Refurbished YAMAHA YV100xg Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute
YAMAHA Second-Hand YV180XG Pick and Place Machine Model YV180XG Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting an
Electronics Forum | Fri Apr 23 14:19:39 EDT 1999 | C.K.
Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these guys.
Electronics Forum | Sat Apr 24 08:23:03 EDT 1999 | Bubba
| Surprisingly enough, ever since the addition of an omega wave, we solder those often-troublesome SOT23's just fine and dandy.. anyways, long-term, well be getting a universal GDM which uses positive displacement pumps..currently we're using fuji g
Used SMT Equipment | SMT Equipment
Model :KE-1070 Pick and Place Machine Placement speed：Chips:18900CPH(0.190sec/chip) Component mount range:0603 chips ~33.5mm Station:80 Power supply:3-phase AC200~415C 3KVA Size:1500*1500*1455mm Weight:1590kg
Used SMT Equipment | SMT Equipment
Model :JX-100 Pick and Place Machine Placement speed：Chips:19300CPH(0.187sec/chip) Component mount range:0603 chips ~33.5mm Power supply:3-phase AC200~415C 1.5KVA Size:1370*1270*1440mm Weight:1000kg
Industry News | 2013-06-07 14:47:43.0
CSM Electronics' Yestech AOI installation - case study
Industry News | 2012-05-15 08:57:25.0
Practical Components Inc., a leading supplier of dummy components, has introduced a display case containing a sampling of components.
Parts & Supplies | Pick and Place/Feeders
KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed. 12,500CPH?chip (laser centering/effective tact) 1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC option. One multi-nozzle
Parts & Supplies | Other Equipment
shaft: KV8-M7106-70 5322 256 92337 KV8-M712S-A0X KM9-M7106-00X KGB-M712S-A0X 5322 535 10674 5322 693 11539 KM1-M710S-AOX KV8-M712S-AOX KGB-M712S-AOX KGB-M711S-AOX KGT-M711S-A0X KGT-M711S-B0X KHW-M7140-B0X KHW-M711S-A0X
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
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LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
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. All fields are required. Your name Your email address Your friend's name Your friend's email Description Philips/Assembleon CSM HEAD Calibration Kit For HEAD calibration of the Eclipse/Sapphire/Comet Pick and Place Machines Asset
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YAMAHA YS12F Flexible SMD SMT Pick And Place Machine For 0402 0603 0805 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
