Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
Whatsapp+86 13425164065 Our AB Potting machine helps AB compounds offer superior protection for electronic circuits industry Our Universal equipment is widely works for epoxies, silicones and polyurethane compounds , we configure different function
ab component adhesive potting and encapsulation machine for PCBa assembly Whatsapp+86 13425164065 Our AB Potting machine helps AB compounds offer superior protection for electronic circuits industry Our Universal equipment is widely works for epo
Whatsapp+86 13425164065 Our AB Potting machine helps AB compounds offer superior protection for electronic circuits industry Our Universal equipment is widely works for epoxies, silicones and polyurethane compounds , we configure different function
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