Industry Directory: die attach wire bond (Page 1 of 3)

MPIQC

Industry Directory | Manufacturer

MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.

RBC Industries, Inc

Industry Directory | Manufacturer

Manufacturers of high performance epoxy and silicone resins for potting/encapsulating, coating, bonding, sealing, and die attach. Thermally conductive, UL listed systems for electronic, electrical, & industrial applications.

R&D Money

Industry Directory |

Quality precision die bonding / pick and place tools, collets, ejector pins, wire clamps

Inseto (UK) Ltd

Industry Directory |

Suppliers Of Microelectronics & PCB Assembly Equipment & Materials, including die bond, wire bond & test & SMT screen printers & pick and place systems.

ESEC

Industry Directory | Other

Supplier to backend semiconductor packaging.

AI Technology, Inc. (AIT)

Industry Directory | Manufacturer

Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.

Vimic Electronic Corporation

Industry Directory | Manufacturer

Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles.

Majelac Technologies

Industry Directory | Manufacturer

Majelac Technologies offers quick turn IC assembly services, including open cavity QFN, wafer dicing, die sorting, wire bonding, BGA reballing, BGA assy, prototype assembly, fine pitch wire bonding, and more,

Microtek, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..

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