New SMT Equipment: ecd and gold and mole and temperature and profil (1)

SuperM.O.L.E.® Gold 2  Flux and Wave Solder Thermal Profilers

SuperM.O.L.E.® Gold 2 Flux and Wave Solder Thermal Profilers

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

Used SMT Equipment: ecd and gold and mole and temperature and profil (1)

Tektronix M.O.L.E. Xpert 3 Oven rider, Wave rider, M.O.L.E. Thermal Profiler and Xpert 6 Super M.O.L.E Gold

Tektronix M.O.L.E. Xpert 3 Oven rider, Wave rider, M.O.L.E. Thermal Profiler and Xpert 6 Super M.O.L.E Gold

Used SMT Equipment | Sensors

ECD M.O.L.E. Lot comes with the following, everything is complete and fully functional, manuals included, plus and spare parts. 1) ECD M.O.L.E. Xpert 3 profile module 2) ECD Xpert 3 Docking station 3) SUPER M.O.L.E. Gold thermocouple system. 4) ECD O

Scientific Devices Exchange LLC. DBA SD Exchange

Industry News: ecd and gold and mole and temperature and profil (4)

SMTA China and Hong Kong Chapter Announce 2011 Best Paper/Presentation and Best Exhibit Awards

Industry News | 2011-09-06 15:20:36.0

SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.

Surface Mount Technology Association (SMTA)

ECD Releases M.O.L.E. MAP 3.00 Thermal Profiling Software; Customers Realize Cost and Time Savings

Industry News | 2012-05-31 14:49:02.0

Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.

Electronic Controls Design Inc. (ECD)

Technical Library: ecd and gold and mole and temperature and profil (1)

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Technical Library | 2007-11-15 15:54:44.0

At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes.

Kester

Express Newsletter: ecd and gold and mole and temperature and profil (572)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM


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