Industry News: edge searching (Page 1 of 6)

MIRTEC Showcases Cutting-Edge Inspection Technology at SMTA International 2023

Industry News | 2023-09-11 16:48:35.0

MIRTEC is excited to announce its participation in the highly anticipated SMTA International Exhibition, scheduled to take place at the Minneapolis Convention Center in Minnesota from October 10-11, 2023. MIRTEC will proudly showcase its groundbreaking MV-6 OMNI 3D AOI Series featuring the exclusive OMNI-VISION® 3D Inspection Technology in booth #1201.

MIRTEC Corp

The Future of Automated Optical Inspection

Industry News | 2021-09-02 06:10:22.0

MIRTEC announces the release of their comprehensive AI based Smart Factory Automation solution 'INTELLI-PRO'. This Technologically Advanced Software and Algorithm Package is specifically designed for the purpose of improving the performance and convenience of MIRTEC's complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.

MIRTEC Corp

MIRTEC to Exhibit its Complete Line of AI-Based SMT and Automotive Pin Inspection Solutions at Productronica 2021

Industry News | 2021-10-11 16:13:11.0

MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.

MIRTEC Corp

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at the SMTA Guadalajara Expo 2023

Industry News | 2023-09-25 14:05:43.0

MIRTEC is pleased to announce its participation in the upcoming SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023. The event is scheduled to take place at Expo Guadalajara in Jalisco, Mexico. In Booth 319, MIRTEC will feature a total of four (4) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry:

MIRTEC Corp

Assure PRO Intelligent X-ray Component Counter Now Available at Demo Location in Florida

Industry News | 2022-07-16 08:27:36.0

Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN), is pleased to announce that it has setup a brand new Assure™ PRO intelligent X-ray component counter at The A & E Group dba Kurt Whitlock Associates Demonstration Lab in St. Cloud, FL for live demos.

Nordson Electronics Solutions

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2010-10-20 21:21:00.0

The SMTA and Chip Scale Review magazine are pleased to announce the 7th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

IPC Offers First Advanced Packaging Symposium Building the IC-Substrate and Package Assembly Ecosystem

Industry News | 2022-08-08 07:10:23.0

Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.

Association Connecting Electronics Industries (IPC)

New Products at IPC APEX EXPO 2016 to Showcase Forward-Thinking Technology and Innovation

Industry News | 2016-02-15 20:06:55.0

New opportunities and answers to industry challenges will abound as leaders in the electronics manufacturing industry debut cutting-edge products and services at IPC APEX EXPO®, March, 15–17, 2016, at the Las Vegas Convention Center. In keeping with the event’s theme, “Forward Thinking for Tomorrow’s Technology,” a significant number of exhibitors will be introducing new products at the show. Exhibitors will also feature chemicals, materials, and equipment for PCB manufacturing, as well as design software and printed electronics.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2011-11-08 15:31:27.0

The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.

Surface Mount Technology Association (SMTA)

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