Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2020-05-03 22:17:05.0
Eelink Temperature Monitoring Solution uses an advanced wireless temperature monitoring technical, which uses cutting-edge temperature becon devices to collect temperature data, and transmits the temperature data to the software APP through the server. This device has built-in high-sensitivity temperature sensors, humidity sensor, ble5.0 chipset.
Industry News | 2010-01-04 20:44:23.0
Ideal for Computers, Instrumentation, Factory Automation Equipment, Industrial Machinery, Power Supplies, Telecom and More
Industry News | 2010-08-27 15:08:50.0
Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. SMT has introduced several machines that accommodate larger, odd shaped substrates. The machines offer the same speed, precision, and repeatability found on SMT’s solder paste printers. This allows heat sink manufacturers to benefit from using proven, cost effective screen print technology
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2003-04-25 08:01:00.0
Initiates Q3 revenue guidance of $190 - $200 million, Outlines $12 million restructuring plan
Industry News | 2005-08-03 13:41:41.0
Combining Low 130-mV Dropout with High 150-mA Current
