Industry Directory | Consultant / Service Provider / Manufacturer
We do Component Level Repair training on Laptops, including BGA work, and hand soldering all SMD components.Included in our packages is the ability to fault find and diagnose problems in circuits.
BGA & QFN Inspection Made Easy! The new BGA Inspector is a standalone software tool capable of analyzing images from different radiography systems. The BGA Inspector is unique in its ability to quickly and easily producing the results you need to v
ScanINSPECT BGA provides a fast, simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, yet slow, measurement systems. ScanINSPECT BGA uses an intuitive process flow interface integrated with a
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Tue May 08 16:06:51 EDT 2001 | caldon
www.empf.org empfasis news letter March 2001 issue "Manufacturing with BGA's" Reading this while impersonating Elvis will generate best results. Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2024-03-18 12:41:07.0
PDR Americas is set to showcase its latest innovations at the 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024, at the Anaheim Convention Center in California. Visit PDR at Booth 3829 to experience firsthand the IR-E3 System for rework and the GenX90 w/ Vector Nav 3D CT Tomography for X-ray.
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
The BGA Inspector standalone tool allows you to perform a complete BGA analysis on any computer platform.
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic801&OB=DESC.html
– Fixed a bug that was causing through-hole parts to fail FPX File Update – Created new BGA FPX in IPC folder and updated SM & FPE FPX files NEW: DFN 2-pin – Added Inductors, Resistors and Capacitors
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
. With the XT V 130, you can get the inside view of printed circuit boards, in a smooth, non-destructive process. The Nikon Metrology XT V130 X-ray inspection system is a high-precision, flexible solution that facilitates defect analysis in loaded PCB boards. Designed for 100% BGA and
