Electronics Forum | Fri Oct 29 13:45:03 EDT 1999 | David Vulcano
We are placing several axial components that have STEEL leads. Have noticed that the steel components do not get good flow thru(we manufacture to IPC-A-610 Class II Standards which reqires 75% flow thru) We are using Seho Wave Machines with Nitroge
Electronics Forum | Tue Feb 01 23:36:43 EST 2005 | Dr Why
How to rework BGA? what is the process flow and what is the equipment require?
Electronics Forum | Tue Mar 06 09:42:15 EST 2007 | realchunks
Hi Mark, Solder paste will not flow on Ni like it appears on HASL. Where you print it is where it will reflow. Has been like that for years. As a CM you should re-engineer / recut your stencil to provide proper solder joints. I seriously doubt i
Electronics Forum | Wed Mar 07 16:14:24 EST 2007 | Mark
Hello, We replated the boards with new Ni and Au and the soldering flow is excellent. There is 100% covarage of the pad even for reduced appertures. Mark
Electronics Forum | Mon Nov 01 09:54:29 EST 1999 | dave r
Jason, Have the class III requirements changed? Dave
Electronics Forum | Mon Feb 21 12:12:10 EST 2005 | gs
Thank you Russ for shearing your experience. Regards..........GS
Electronics Forum | Thu May 01 09:09:31 EDT 2008 | scottp
I looked at some no flow underfills about 5 years ago and they weren't quite ready for prime time yet. It's time to give it another look and I'm wondering if anyone is using them in production and how it's working. I'm looking at them for reducing
Electronics Forum | Mon Nov 01 15:47:21 EST 1999 | Jim Snipes
Dave thaanks for your quick reply. The flow through probelm exists on several component, Examples; small Tan electolic caps.,electrolic epoxy caps. and one specfic lad on a resistor network. I have veried conveyor speed and readjusted heat sett ings
Electronics Forum | Tue Dec 05 03:39:39 EST 2006 | pavel_murtishev
Good afternoon, Due to problems with power connector soldering I have to overprint paste on pads for this connector. Stencil thickness is 125um and I cannot make it thicker. Area ratio of chip resistor assemblies limits stencil thickness to 125um. R
Electronics Forum | Sat Oct 30 16:53:19 EDT 1999 | jason
David I have recently taken the IPC-A-610B instructors course and according to the teacher the revised addtion is suppose to be 50 percent fill in plated thru holes
