Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Solder Joint Void Classifications [3] Figure 2a. Locations within a BGA solder joint where voids are expected to have a greater risk on joint reliability [3]. mailto:richard.coyle@nokia-bell-labs.com mailto:david.hillman
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Solder Joint Void Classifications [3] Figure 2a. Locations within a BGA solder joint where voids are expected to have a greater risk on joint reliability [3]. mailto:richard.coyle@nokia-bell-labs.com mailto:david.hillman
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
recorded. It should be noted that only two failure modes were observed during the shear testing. They are fracture at the solder joint and component failure. For most of the samples the fracture mode was at the solder joint interface. In the data analysis
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
recorded. It should be noted that only two failure modes were observed during the shear testing. They are fracture at the solder joint and component failure. For most of the samples the fracture mode was at the solder joint interface. In the data analysis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=11
borescope imaging system (similar to an endoscope) and the sample being tested can be displayed on an LCD monitor enabling the operator to easily align the shear tool to the ball bond and more accurately assign a failure mode grade
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection
. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/micro-materials-tester?con=t&page=9
provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws. Modern 2D / 3D X-ray Inspection - Emphasis on BGA, QFN, 3D Packages and Counterfeit Components Nordson DAGE Does PCB Pad Finish affect Voiding Levels in Lead-Free Assemblies Nordson DAGE Ready for
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor
. Dage’s range of test and inspection tools catch manufacturing defects both on wafer and in final packaged components, before product leaves the factory
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?page=1
. Dage’s range of test and inspection tools catch manufacturing defects both on wafer and in final packaged components, before product leaves the factory
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
