331 gold plating edge connectors results

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale

SMT Express, Issue No. 5 - from SMTnet.com

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SMT Express

Horizontal Convection Reflow Technology Defined

Developing an effective, fast-curing, environmentally sound conformal coating

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SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

SMT Express, Volume 3, Issue No. 4 - from SMTnet.com

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study