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We specialize in EMI Ferrite Core, Thermal Pads, Gaskets and shielding products.
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CAD Design Software products run in the AutoCAD environment.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
Electronics Forum | Thu Dec 15 11:06:05 EST 2005 | Samir Nagaheenanajar
You might wanna try a small reduction in your stencil aperture. For example, for a 30-mil pad go 26-mil square aperture with 8 to 10-mil radius on your corners. Also, look at your designs. Is there enough resist between your pad and ball? Another
Electronics Forum | Wed Aug 29 05:30:30 EDT 2018 | teresat2
I guess these boards only used Fly test. Flying needle test is one of the methods to check the electrical function of PCB (short circuit test). The flight test machine is a system for testing PCB in a manufacturing environment. Instead of using the
Used SMT Equipment | Repair/Rework
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Used SMT Equipment | General Purpose Equipment
Blue M Mechanical Convection Oven, 96 cu.ft., F4 Control Product includes the following installed options: Computer Interface: RS485 Standard with Controller Door Style: Standard Double Door Door Hinge: Standard Special ETO Option : Install leve
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2003-02-11 08:42:41.0
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Parts & Supplies | Pick and Place/Feeders
Grounding plate for short circuit test
Parts & Supplies | Assembly Accessories
amaha Mounter: also known as "mounting machine" and "surface mounting system", in the production line, it is a kind of equipment that can accurately place surface mount components on PCB pad by moving the mounting head after dispe
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
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Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-reduce-emi-in-printed-circuit-boards/
. Techniques to Manage EMI in PCBs Although EMI will always be a factor in PCB design, that doesn’t mean it’s impossible to control. Design techniques including trace layout and ground plane composition can significantly reduce the amount of EMI in your circuit board
