New SMT Equipment: heller 18mm 1809exl-n2 (2)

Nitrogen Wave Soldering Machine KTN-450

New Equipment | Wave Soldering

Nitrogen Wave Soldering Machine KTN-450 Products description Infrared heating method, by this method, the air won't flow, It can keep high level nitrogen level in soldering part. easy to reach 30-50 PPM. High nitrogen level make

Kait High Tech Co.,ltd

Nitrogen Wave Soldering Machine KTN-450

Nitrogen Wave Soldering Machine KTN-450

New Equipment | Wave Soldering

Nitrogen Wave Soldering Machine KTN-450 Nitrogen Soldering Process Solder pot capacity 480kg Weight Approx.2500kg Dimension: 5500*1600*1730mm Product description: Nitrogen Wave Soldering Machine KTN-450,Nitrogen soldering process,PCB no need c

Kait High Tech Co.,ltd

Electronics Forum: heller 18mm 1809exl-n2 (1)

Flason SMT Products

Electronics Forum | Thu Oct 04 00:03:28 EDT 2018 | gaintstar

flason smt pick and place machine: http://www.flason-smt.com/product/Hanwha-IC-placer-SM321-High-Speed-SMT-Modular-Chip-Mounter.html http://www.flason-smt.com/product/Hanwha-Pick-and-Place-Machine-DECAN-F2-High-Speed-SMT-Modular-Chip-Mounter.html htt

Used SMT Equipment: heller 18mm 1809exl-n2 (6)

Technical Library: heller 18mm 1809exl-n2 (1)

The Last Will And Testament of the BGA Void

Technical Library | 2015-01-05 17:38:26.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Rockwell Collins

Express Newsletter: heller 18mm 1809exl-n2 (657)


heller 18mm 1809exl-n2 searches for Companies, Equipment, Machines, Suppliers & Information

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Heller Industries Inc.
Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

OEM / Manufacturer of Assembly Equipment / Soldering

4 Vreeland Rd.
Florham Park, NJ USA

Phone: 973-377-6800

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
PCB Inspection services

Wave Soldering 101 Training Course
Assembly Automation Technology

MIRTEC - the Global Leader in PCB INSPECTION Technology.