Industry Directory | Consultant / Service Provider / Manufacturer
HEPCO, Inc. is the world's leading manufacturer of Component Lead Prep, BGA Reballing, and RoHS/WEEE & Lead-Free Testing Equipment.
The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re
New Equipment | Solder Materials
For BGA's and PCB Production and Rework Sphere Accurate to +/- .001, All standard sizes available Standard Sizes of Sphere's: .035" +/- .002 10SN/90PB High-Temp .030" +/- .001 63SN/37PB .022" +/- .001 63SN/37PB .016" +/- .001 63S
Electronics Forum | Wed Jun 07 16:34:09 EDT 2000 | CJ Bonifas
Are there any other manual reballing systems aside from the one made by Hepco that use a vacuum method for ball placement?
Electronics Forum | Tue Jul 19 09:06:00 EDT 2016 | davef
We used to use those, back in the bad old times. basically, it's a router with a blade on it that is used to trim the leads of PTH components that are mounted on boards. Nasty process. Difficult to control. Messy, firing cut leads all over the plac
Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment If you don't see the images, please visit online version at #Application
.png)
