New Equipment | Fabrication Services
High Layer Count, High Complexity, High Reliability. At i3 Electronics, we offer the total package for your printed circuit board fabrication. We can design, manufacture, assemble, and test your PCB. Our specialty is high layer count, high complexi
Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini
Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards
Electronics Forum | Thu Oct 17 05:16:44 EDT 2013 | vincentdesilva2003
Anyone can help me how many percentage of blowholes and pinholes if i do the followings: 1. Increase copper plating thickness more than 25 microns. 2. Pre Baking of PCB to remove gassing by drying out the PCB's
Industry News | 2013-11-15 16:37:31.0
In an independent global survey of SMT manufacturers*, MYDATA found that many of the classic production challenges facing low-volume, high-mix producers have now reached a "tipping point" for higher volume producers as well. The survey revealed that several key challenges are common to low-, mid- and high-volume producers: changeover efficiency, quality, line utilization, stock accuracy and reducing the cost per mounted component.
Industry News | 2014-03-27 13:30:41.0
At APEX 2014 in Las Vegas, MYDATA will introduce to the North American market its new MY200 placement machine, delivering twice the accuracy and higher throughput.
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
—it means carefully considering many intricate factors like signal integrity, power distribution, and thermal management. Ultimately, the layout design will include information like how to route the traces, the component footprints, placements of layers, and vias
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/micro-testing-thin-die
interconnect at the packaging level. This article takes a look at how micro materials testing and advanced bond testing has evolved to provide solutions
