Industry Directory: i/o (32)

Data I/O Corporation

Industry Directory | Manufacturer

Data I/O is the world's leading provider of manual and automated programming solutions for semiconductor (IC) devices. Data I/O's solutions, software and programming engine ensures devices are programmed correctly every time.

Sealevel Systems, Inc.

Industry Directory |

Sealevel Systems, Inc., founded in 1986, provides serial and digital I/O communications products to the industrial automation and control industries. The company manufactures PCI, CompactPCI, USB, PCMCIA, ISA, and PC/104 serial and digital I/O cards.

New SMT Equipment: i/o (49410)

Benchtop Dispense Robots

Benchtop Dispense Robots

New Equipment | Dispensing

Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard

GPD Global

5g Design Services

New Equipment | Design Services

We provide 5G design services IOT including an expansive choice of engineering services pertaining to Internet of Things Networks that are sensor-driven in nature, ranging from IoT architecture designing and development to manufacturing. EDGE DEVICE

Whizz Systems

Electronics Forum: i/o (229)

GSM Discrete I/O Address List

Electronics Forum | Sun Jan 17 20:36:49 EST 2016 | ttheis

I'm trying to configure the nozzle changers on my GSM1 machine because they were not configured when I bought it. I've figured out most of the setup with the UPS documentation, but I don't know what the I/O addresses are for the changers. Does anyon

FuJi IP 3 - CRTA event I/O

Electronics Forum | Wed Jun 16 16:49:16 EDT 2010 | nguyennca

I have an error that stop FIP 3 from running. The error is "FIP OSS2 R3.1Bi CRTA event I/O. If anyone knows what this error is about then please help. Thanks

Used SMT Equipment: i/o (86)

YesTech 2050

YesTech 2050

Used SMT Equipment | AOI / Automated Optical Inspection

Make: Yestech Model: 2050 Vintage: 2004 Details: • 22” x 20” in size • Vision Processor board set with PCB inspection software • Windows XP based user interface • CAD/placement interface software • Flat panel display • Industrialize

Lewis & Clark

Teradyne Spectrum 8852

Teradyne Spectrum 8852

Used SMT Equipment | In-Circuit Testers

Teradyne Spectrum 8852 In Circuit Tester For Sale The tester is configured as follows: Front Cage FIB-0 / MX1 VP Prism (8) CC2-DIG-128ch FIB-1 / TEK Rear Cage (1) CC2-DIG-128ch VP-EXT MXI Note: Tektronix VX4101A (VXI MultiPaq Inst

1st Place Machinery Inc.

Industry News: i/o (400)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

NEW Benchtop Dispensing Robot!

Industry News | 2018-02-12 12:28:00.0

GPD Global introduces its NEW full-featured benchtop dispensing robot system: Catalina. A benchtop system does not mean "no features". This compact and efficient semi-auto dispense robot provides you with numerous standard features: automatic vision, laser surface sensing, and automatic nozzle alignment and calibration.

GPD Global

Parts & Supplies: i/o (2974)

Technical Library: i/o (14)

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

Advanced Packaging of SMT Assemblies for Greater Cost Reduction

Technical Library | 2019-06-06 13:40:47.0

Legacy electronics assemblies, such as through-hole (Figure 1) and connectorized component packages, are robust and prevalent throughout industry. However, each of these assembly methods have reached their limits in terms of weight, volume, reliability, and most importantly cost. With cost reduction of assemblies now the primary focus area throughout the electronics industry, there is more of a need than ever to implement the latest advancements in surface mount technology (SMT) into electronics assembly designs. Although SMT has been utilized in the electronics industry for many years, implementation of the technology is still in the ever-evolving process of reducing component footprint size, component spacing, and component I/O pitch. Implementation of the most up-to-date SMT processes provides optimal weight, volume, and cost savings, for any type of assembly.

ACI Technologies, Inc.

Videos: i/o (750)

Juki ATC OFFSET NOSS(80) 40053311

Videos

E9622729000 KE2010 X motor TS4509N2821E200 E9624729000 KE2010 Y motor TS4515N2821E201 E9629729000 KE2010 Z motor TS4633N2020E600 E9630729000 KE2010 T motor TS4632N2020E600 40000727 KE2050 Y motor TS4616N1020E200 40003253 KE2050 Z motor TS4633N20

Qinyi Electronics Co.,Ltd

Juki BACKUP PIN ASSY E2021750A0

Videos

E9622729000 KE2010 X motor TS4509N2821E200 E9624729000 KE2010 Y motor TS4515N2821E201 E9629729000 KE2010 Z motor TS4633N2020E600 E9630729000 KE2010 T motor TS4632N2020E600 40000727 KE2050 Y motor TS4616N1020E200 40003253 KE2050 Z motor TS4633N20

Qinyi Electronics Co.,Ltd

Training Courses: i/o (2)

Design for Testability and for Built-in Self Test

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

EECS at University of California

Design for Testability and for Built-in Self Test

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

A.T.E. Solutions, Inc.

Career Center - Jobs: i/o (5)

Circuit Design Electronic Engineer

Career Center | Dallas, Texas USA | Engineering

Skills/Requirements: BS in Electroincs Engineering(3.0 min GPA) 5+ years designing PC based or embedded products, Mentor graphics or similar EE CAE for circuit design, similation and maintenance, troubleshooting of PC chip set and processor level on

EMSR, Inc.

PC Engineer-G-Site and Passport POS System

Career Center | Dallas, Texas USA | Engineering

Skills/Requirements: BS Electronics Eng, 3+ years working with PC based products, knowledge of PC motherboards, chip sets, processors, PCI DRAM, I/O parts, Internal PC sub-assemblies, PC 99, PC2000, PCI and Windows. Duties/Functions: System quotes, s

EMSR, Inc.

Career Center - Resumes: i/o (9)

B.tech_Fresher in Electronics & Communication Engineering

Career Center | Noida, India | Engineering

I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e

B.tech_Fresher in Electronics & Communication Engineering

Career Center | Noida, India | Engineering

I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e

Express Newsletter: i/o (19)

SMTnet Express - September 27, 2018

SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237 Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder Bottom

Partner Websites: i/o (7279)

PANASONIC I/O BOARD N1F8W11B | QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/n1f8w11b-i-o-board-192498?page=614&order=name+asc

PANASONIC I/O BOARD N1F8W11B | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products I/O BOARD Public Pricelist Public Pricelist I/O BOARD

Qinyi Electronics Co.,Ltd

4660K - ADAPTOR, 16-24VDC D I/O HDIO16

Heller Industries Inc. | https://hellerindustries.com/parts/4660k/

4660K - ADAPTOR, 16-24VDC D I/O HDIO16 Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.


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