Electronics Forum | Wed Feb 04 21:06:07 EST 2009 | shan
I'm looking for test labs in Taiwan that are capable of performing ionic contamination testing on small to medium sized SMT boards. I'm interested in both ion chromatography and ROSE test methodologies. Is anyone aware of any labs performing contami
Electronics Forum | Mon Feb 27 13:02:13 EST 2006 | masrimhd
Hi, Thank you for your answers. But I want to explain some points on which I would appreciate any comment: * Having calibrated the process, we intend to carry out the ROSE test just on SAMPLES of the finished boards. Lets say one every hour. I exp
Industry News | 2018-02-20 17:58:44.0
STI Electronics is pleased to announce that Marietta Lemieux, Analytical Lab Manager, will present at the Electronics in Harsh Environments Conference. The event is scheduled to take place April 24-26, 2018 in Hoofddorp (Amsterdam), Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments.
Technical Library | 2017-12-11 22:31:06.0
Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.
Technical Library | 2011-01-13 17:37:55.0
The tin whisker failures investigated in this paper were found on functional RoHS-compliant hardware. The samples were not conformal coated. This paper will document the conditions associated with the whisker formation under the following conditions; tin
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