Industry News | 2012-08-09 18:42:34.0
IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2021-02-15 14:41:46.0
– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
Industry News | 2012-12-17 19:16:10.0
IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.
Industry News | 2010-04-10 02:05:54.0
IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
Industry News | 2010-12-03 21:35:04.0
Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
Industry News | 2014-01-17 12:52:25.0
BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.
Industry News | 2016-02-18 20:27:15.0
SolderLab today announced plans to exhibit in Booth #2913 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The company tests solder for alloy impurities based on industry standard IPC guidelines for J-STD-006C and J-STD-001F.
Industry News | 2015-02-24 17:11:27.0
PARMI announces that it has been awarded a 2015 NPI Award in the category of Test & Inspection – SPI for its Jet Defect Repair Feature. This represents the third consecutive year that PARMI has received the award, which was presented during a Tuesday, Feb. 24, 2015 ceremony at the San Diego Convention Center during the IPC APEX EXPO.
IPC is the trade association for the printed wiring board and electronics assembly industries.
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