Industry News: lcc and socket (Page 1 of 6)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Count On Tools Introduces 300-Series Nozzles for Assembléon and Yamaha Equipment

Industry News | 2010-06-11 14:35:28.0

GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, has released a full line of standard 300-series nozzles for the Assembléon MC-24 and MC-24X as well as the Yamaha YG300. The new line is capable of handling components sizes from 01005 to larger BGAs and QFPs for large mix and minimum changeover to optimize production lines.

Count On Tools, Inc.

Aries' New Cost-Effective CSP/MicroBGA Test and Burn-In Socket

Industry News | 2003-07-08 09:09:15.0

Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz

Aries Electronics Inc

Prototype and Debug 96 ball BGA with Ease

Industry News | 2011-02-14 16:05:28.0

Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.

Ironwood Electronics

Multitest’s Valts Treibergs and Chris Cuda to Present at BiTS 2010

Industry News | 2010-02-15 19:32:28.0

Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Valts Treibergs and Chris Cuda will present a paper titled “Spring Probe PCB Pad Wear Analysis” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.

Multitest Elektronische Systeme GmbH

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix

BPM Microsystems Lowers Prices for 8th Generation and Flashstream Socket Solutions

Industry News | 2012-04-25 16:52:28.0

BPM Microsystems announces that it has reduced pricing for its popular 8th Generation and Flashstream socket solutions supporting NAND, NOR, Serial and EPROM flash memory.

BPM Microsystems, Inc.

BPM Microsystems to showcase 8th Generation automated and manual programming solutions at APEX 2012

Industry News | 2012-01-22 23:47:52.0

BPM Microsystems will demonstrate its 8th Generation model 3800 automated programming system and model 2800 manual programming system in Booth 3702 at the upcoming IPC/APEX conference and exhibition. The company’s latest series of device programmers combines the unrivaled speed of Vector Engine Co-Processor® with BitBlast technology plus true universal device support, resulting in the fastest universal programmer in the industry.

BPM Microsystems, Inc.

Data I/O to Showcase PSV7000 with Process Control Software for Automotive and Internet-of-Things Applications at APEX

Industry News | 2017-01-10 14:55:25.0

Data I/O Corporation will showcase the PSV7000 with process control software solutions to meet demanding requirements from Automotive and Internet-of-Things applications in Booth #2741 at the IPC APEX EXPO, scheduled to take place February 14th – 16th at the San Diego Convention Center in San Diego, CA.

Data I/O Corporation

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