Industry Directory | Manufacturer
Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.
Industry Directory | Distributor / Manufacturer
For over 60 years, Kapp Alloy & Wire, Inc has been a premier manufacturer of Babbitt, solder, and metallizing spray wire. Our goal is perfection in solder and service.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
ProntoSELECTIVE-SOLDERING is used by electronic manufacturers to quickly program their Selective Soldering machines. ProntoSELECTIVE-SOLDERING helps program most popular Selective Soldering machines such as ACE Production Technologies, RPS Autom
Electronics Forum | Mon Jan 07 21:07:00 EST 2002 | davef
Using a flux pen sounds like a good idea. Comments are: * I assume you�re talking aqueous flux. If not, some NC flux pens leave white residues. Nearly all of 15 samples suffered to varying degrees with white residues. * Use the same flux that you
Electronics Forum | Tue Jun 16 14:46:25 EDT 2009 | grantp
Hi, If your using NXT to place these BGA's then you must be doing large runs. BGA's are the most easy part to place, and don't worry about them. Just stencil paste down for them as any other component. But we use 1:1 reduction on our stencil, so we
Used SMT Equipment | Soldering Equipment/Fluxes
Model: FlexSolder W620 Vintage: 2012 (demo’ed only, never used!) Description: Inline soldering system. (With servo driven XYZ gantry, and tilt able gripper from 0° to 7° degrees for direct PCB handling) Details: • Spray fluxer •
Used SMT Equipment | Soldering - Reflow
Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
Nano-copper sintering in formic acid vapor.
www.unisoft-cim.com/solder.htm - The ProntoSELECTIVE-SOLDERING module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB Selective Soldering machines in minutes. ProntoSELECTIVE-SOLDERING helps prog
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Mon May 10 00:00:00 EDT 2021 - Mon May 10 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Manual Cleaning of Printed Board Assemblies – Step by Step Guide
Career Center | New Castle, Pennsylvania USA | Production
Surface Mount Tech - Printed Circuit Board (PCB) Summary: **All applicants must be familiar with: Quad 4C equipment*** Will be responsible for Surface Mount Parts and Screen Printing Other responsibilities may include: Moves controls to activate
Career Center | South Plainfield, New Jersey USA | Engineering,Research and Development
MacDermid Alpha Electronics Solutions, a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seeking a Scale-Up Technician/Chemist&
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
SMTnet Express, August 31, 2017, Subscribers: 30,770, Companies: 10,706, Users: 23,739 NSOP Reduction for QFN RFIC Packages Mumtaz Y. Bora; Peregrine Semiconductor Wire bonded packages using conventional copper leadframe have been used in industry
| https://www.eptac.com/webinar/dealing-with-the-order-of-precedence-when-using-ipc-standards/
Dealing With the Order of Precedence When Using IPC Standards | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/grnreflo.pdf
. Among other activi- ties, a new, lead-free solder paste and reflow profile were developed. The primary differ- ences between the new process and a traditional process using lead-based solder are the higher melting point of the paste and the demanding thermal profile required to process it effectively
