Solder powders are the key component of all solder pastes. Pastes made with the same flux but with powders that differ in particle sizes often have different rheological/physical properties resulting in differences in screen/stencil printing, compone
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Electronics Forum | Tue Aug 03 10:11:11 EDT 2010 | keiths487
we have an HSP that keeps giving nozzle level (low) out of tolerance, we have performed lighting check, also this condition is only showing up on 3 or 4 heads...any input appreciated
Electronics Forum | Tue Aug 03 16:12:54 EDT 2010 | namruht
Just to get the simple stuff out of the way. Make sure that no one has changed the machine nozzle data to a different type. Then try actually changing the nozzle data and putting that type into the head. If this passes it will at least eliminate the
Industry News | 2017-05-11 17:06:16.0
Library Expert Lite automatically builds footprints and 3D STEP models for tens of millions of parts, for free.
Industry News | 2009-01-30 16:57:01.0
RO-VARIO, the new developed reflow and curing oven from Essemtec, offers a unique modularity and flexibility for a number of solder and hardness tasks in the electronics and solar engineering industries. The first ovens were delivered to the customers earlier this month.
Technical Library | 2019-09-11 23:33:04.0
There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.
Reel input : Diam. 180 / 330 / 380 / 560 / 760mm (7 / 13 / 15 / 22 / 30 inches) Reel output : Diam. 180 / 330 / 380 / 560 (13 / 15 / 22 inches) Tape advance - stepper motor Positioning tolerance : +/- 0.02 Software controlled adjustable pitch fr
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:57amControlling the through-hole lead length has always been possible. All through-hole leads stop at the top of the PCB. The User enters a value on how far the lead goes through the board and out the back.