Technical Library: materials (Page 1 of 34)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Thermal Interface Materials Drive Electronic Innovation

Technical Library | 2024-08-20 00:41:48.0

Thermal interface materials (TIMs) play a pivotal role in ensuring efficient thermal management by facilitating heat transfer between heat generating components and heat-dissipating devices

GPD Global

What is Underfill

Technical Library | 2024-03-19 15:53:34.0

Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.

GPD Global

Thermal Interface Material (TIM) Dispensing For Consumer Products

Technical Library | 2023-08-16 18:25:16.0

In one of our Consumer Electronics projects, a leader of networking technologies requested to test dispensing performance of a thermally conductive material, Fujipoly Sarcon SPG-50A. This material improves heat dissipation for higher frequency applications and reduces the negative effects of thermal resistance under heat, cold, humid, and thermal shock conditions. The customer's goal was to dispense a 1mm diameter dot with acceptable speed and consistency.

GPD Global

Underfill Materials Dispensing in Electronics Manufacturing Applications

Technical Library | 2024-08-20 00:40:08.0

In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.

GPD Global

Dam and Fill Dispensing for Medical

Technical Library | 2023-08-16 18:02:27.0

One of our customers in the medical industry requested dam and fill application testing on a Kapton substrate. The material needed to be non-conductive for dispensing around electrical components, acting as structural support. Ultimately the product will be folded, therefore the footprint had to be small.

GPD Global

Underfill Dispensing For Aerospace Military And Defense

Technical Library | 2023-08-16 18:20:44.0

One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.

GPD Global

LED Encapsulation for Consumer Products

Technical Library | 2023-08-16 18:13:53.0

In one of our Consumer Electronics projects, a smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes. The larger product had a 9mm circular dam which required silicone dispensing flush with the top of the dam. The smaller product had a 1mm LED die that required only the top to be encapsulated. The material consisted of two parts which were mixed by weight in a 1:1 ratio. A phosphor powder was added totaling 10% of the overall weight. The phosphor required agitation to remain suspended.

GPD Global

Staking/Epoxy Adhesive Dispensing for Aerospace

Technical Library | 2023-08-16 18:48:50.0

One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"

GPD Global

KE-2050/KE-2060 Causes and Countermeasures of Patch Failure

Technical Library | 2023-07-22 02:26:05.0

Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

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