Used SMT Equipment: mc385v1v (Page 1 of 1)

Manncorp MC385V1-V

Manncorp MC385V1-V

Used SMT Equipment | Pick and Place/Feeders

Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability

Lewis & Clark

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mc385v1v searches for Companies, Equipment, Machines, Suppliers & Information

Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

High Precision Fluid Dispensers
Void Free Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications
Selective soldering solutions with Jade soldering machine

High Resolution Fast Speed Industrial Cameras.
Software for SMT

Benchtop Fluid Dispenser