Industry Directory | Manufacturer
SAFE-PCB Group is a global leading provider of time-critical and technologically complex PCBs, attractive for small and medium volume quick-turn orders. We provide 2-hour images for validation, same day production, and wide range.
Industry Directory | Manufacturer
Since 1971, Eagle Electronics Inc. has provided our Customers with the highest quality Printed Circuit Boards at fair and competitive prices.
Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
Effective and efficient solution for the most challenging printing applications. The MPM Momentum II stencil printer is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine
Electronics Forum | Wed Apr 25 10:15:06 EDT 2012 | cyber_wolf
Does anyone have a source for micro cross section supplies? I know about Buehler...was looking for another.
Electronics Forum | Wed Apr 25 12:16:09 EDT 2012 | markhoch
You might want to take a look at Allied High Tech. I was investigating this same thing a few years ago. I never purchased it, so I can't vouch for the product itself, but it's another option. http://www.alliedhightech.com/grinding/xsectiontool/
Used SMT Equipment | Screen Printers
Ekra Type model – X5 Serial-Number – X5 01089 Alignment Repeatability - +12.5 µm@6sigma Printing speed - 9mm/sec to 200mm/sec Printing pressure – 0kg to 26kg Frame size – 736mm*736mm*38mm Pr
Industry News | 2003-04-14 09:17:40.0
AeA Micro Cap Virtual Conference to be held Online May 16th
Industry News | 2016-02-23 20:21:43.0
IPC – Association Connecting Electronics Industries® announces the release of the IPC-2221B Gerber Coupon Generator, a new annual subscription service for IPC members. The IPC-6012C-TC Test Coupon Addendum to the IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards, allows a user or supplier to enter into an agreement to use the new IPC-2221B Appendix A test coupon designs for acceptance of production lots. Not doing so results in micro section evaluations based on outdated test designs going back to the late 1980s, which do little to properly assess modern technology needs.
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Parts & Supplies | Pick and Place/Feeders
SIEMENS - Pressure control valve CP20 P2 03136795-04 Turn Gear/DLM1 ..00337640S01 Valve Plunger complete SP12 (plastic)(6ps/box) 00351498-03 ..00351498-03 VALVE DRIVE PLACEMENT CIRCUIT DLM2/DLM3 ..00368075S04 REAR DEFLECTION ROLL COMP X B
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Parts & Supplies | Assembly Accessories
Samsung SM321 mid-section conveyor belt J6602083A The following samsung parts are all availble: J91691001A FEEDER_BOARD_BRK_ASSY J91691001A J90571006A_AS FEEDER_BASE_MODULE J70570260C TOP PLATE J68081070A HANDLE_NUMBER_STICKER J6001400650 SOC
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2021-09-21 20:20:22.0
The electronics industry has been using the epoxy puck for the processing of the vast majority of electronics microsections since the 1970s. Minimal advancements have been seen in the methods used for precision micro-sections of PCBs, PCBAs, and device packages. This paper will discuss different techniques and approaches in performing precision and analytical micro-sections, which fuse the techniques and materials common in preparation of silicon wafers and bulk materials. These techniques have not only been found to produce excellent optical results, but transfer effectively to SEM for high magnification inspection and further analysis with minimal post-lapping preparation needed. Additionally, processing time is reduced primarily due to a significant reduction of bulk material removal earlier in the preparation, therefore needing less removal at later lapping steps compared to traditional sectioning methods. Additional techniques are introduced that mitigate some classic challenges experienced by technicians over the decades.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Micro-Sectioning of PCBs for Failure Analysis Thank you for being a part of SMTnet. From all of us at SMTnet, we wish you a happy and prosperous New Year! Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred
SMTnet Express, September 23, 2021, Subscribers: 26,674, Companies: 11,444, Users: 26,860 Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722
Microstructure and Performance of Micro CU Pillars Assemblies 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
Problems With PCB Micro Voiding - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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