Industry Directory | Manufacturer
Mini Micro Stencil, Inc. specializes in BGA, QFP, PLCC and custom
Industry Directory | Consultant / Service Provider / Manufacturer
Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.
Repeatable Printing Quality for High Yields The new Momentum II HiE is a single-rail stencil printer with servo motors, rather than stepper motors, driving the vision system’s X, Y, and Z axes. Faster than steppers, servos drive the visi
The MPM® Momentum® II BTB™ (Back to Back) configurable stencil printer allows dual-lane processing for higher throughput but without increasing either line length or capital investment. The Momentum II BTB stencil printer is t
Electronics Forum | Sat May 29 22:10:28 EDT 1999 | Earl Moon
| We are looking into frameless stencil systems for screen printing. Outside frame size of 29x29. | | Pros: smaller storage requirements and cheaper stencils. | | Cons: sharp metal edges, additional change over time required | | Can anyone relay
Electronics Forum | Mon Oct 14 17:59:45 EDT 2002 | russ
When I used the micro-stencils, We purchased the holder from the stencil manufacturer. As far as design we used 5mil stencils for uBGAs,6-7 mil for larger 63/37 balls, and 8 mil for CBGAs. Aperture openings used were slightly smaller than what we wo
Used SMT Equipment | Screen Printers
DEK Horizon 02i Automatic Screen Printer Dek Horizon 02 Specifications: Dek Horizon Repeatability: 1.6 Cpk @ 25µm Cycle time: As fast as 10 seconds Setup time less than 10 minutes Changeover time: less than 2 minutes Optimi
Used SMT Equipment | Screen Printers
EKRA X6 Screen and Stencil Printer Year: 2006 Reconditioned, in perfect working order. Automatic In-Line Stencil printer with steel welded frame; Two independent pneumatic Print Heads; EVA™ vision system with 2 cameras; Side and Top Clam
Industry News | 2015-10-28 15:22:47.0
EMS provider Micro Industries in Westerville, Ohio will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on December 1, 2015 and the closing will begin at 11:00am EST on December 3, 2015
Industry News | 2015-11-28 10:47:28.0
EMS provider Micro Industries in Westerville, Ohio will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on December 1, 2015 and the closing will begin at 11:00am EST on December 3, 2015.
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
Parts & Supplies | Assembly Accessories
(P326M-200MDG) AVK 2B DRIVER DV47L200MDG ...40026784FX-1 YB Axis Driver Repair &nbs
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
specified board, micro-stencil, part, and solder paste to
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_screen_printers_dek249.html
DEK 249 DEK 249 Semi-Automatic Screen Printer Manufacturer: DEK Model Number: 249 Serial Number: 99421 Type: Semi-Automatic Screen Printer Micro DEK Control 20 x 20 Stencils 110 volts 60 HZ Unit Size
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/efd/products/dispense-tips?con=t&page=13
per le applicazioni di dosatura, PrintPlus® per applicazioni di serigrafia per mezzo di stencils, e paste flussanti… Valvole della Serie PICO Pulse Manuale operativo Nordson EFD La valvola modulare PICO Pμlse® è
