Electronics Forum | Fri Aug 10 19:49:32 EDT 2001 | nifhail
What would be the best method for attaching the balls, when doing BGA rework. I Found that by using the solder paste, it will give us better rework yield vs using the paste flux ? My data was collected from a very small experiment and hard to conclud
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Sat Jul 14 08:56:39 EDT 2001 | davef
Cal is right on target. I'll expand on his points. BGA solder perform suppliers: * Winslow Automation: http://www.winslowautomation.com/ * Galahad 12784 Tulipwood Circle Boca Raton, FL 33428 561-487-0271 galahad.inc@usa.netemail: BGAKIT@concentric
Electronics Forum | Wed Jul 15 12:31:20 EDT 2009 | rwyman
Depending on the end use of the PCB, edge or corner bonding may be adequate. Much easier to rework as the material is only at the perimeter of the part. We don't do underfill of any degree in-house but a few years ago we did build a limited run of
Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Fri Mar 30 11:05:44 EDT 2007 | realchunks
Hi Chris, A lot of it has to do with your product, t-shooting devices and techs ability. There are ways to determine BGA are at fault. X-Ray is a good way to check for shorts. Insufficients are harder to find. Some people use a dye. They squirt
Electronics Forum | Tue Mar 09 22:20:16 EST 2004 | Ken
Is this a PBGA? If yes. run a flat steel rule or edge across the top of the PBGA. Is it flat or cupped? Is this a TBGA (super bga). I have seen issues with a suppliers heat spreader design that actually will deflect the corners down and raise the
Electronics Forum | Mon May 27 12:14:35 EDT 2002 | arcandspark
I use the exact same paste flux that we use in our solder paste for SMT manufacturing with great success. I have also had great success using the Air Vac DRS Hot Gas units with the same size BGA's. If to much heat is applied to fast to the BGA be it
Electronics Forum | Wed Nov 01 08:02:16 EST 2000 | Wolfgang Busko
Massimo: Do you encounter or see warpage of the device or the PCB, I think I remember that there was a thread about this topic of shorts of the corner pins of BGA. You might try the archive. Wolfgang
