| https://www.smtfactory.com/What-is-the-application-prospect-and-development-direction-of-Lyra-Reflow-Oven-id43172477.html
. For example, the internal components such as computers and TVs that are usually used are all soldered by reflow soldering technology, so that there are parts such as motherboards and circuit boards
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/articles/nordson-yestech-helps-trenton-systems-ensure-consistent-quality-for-its-us-made-technologies
. The servers use Trenton Systems’s U.S.-made single-board computers, backplanes and embedded motherboards for critical embedded computing applications
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/ultralow.pdf
. High thermal mass boards such as back planes and mainframe motherboards would benefit from bottom side forced convection modules. These modules are an available option for the Ultralow II model and would cause a modest increase in gas consumption
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/ultralow.pdf
. High thermal mass boards such as back planes and mainframe motherboards would benefit from bottom side forced convection modules. These modules are an available option for the Ultralow II model and would cause a modest increase in gas consumption
| http://etasmt.com/cc?ID=te_news_bulletin,23762&url=_print
. High thermal mass boards such as back planes and mainframe motherboards would benefit from bottom side forced convection modules. These modules are an available option for the Ultralow II model and would cause a modest increase in gas consumption
54415 | http://hellerindustries.com.cn/ultralow.pdf
Heller 公司
| http://etasmt.com/te_news_bulletin/2021-08-31/23762.chtml
. High thermal mass boards such as back planes and mainframe motherboards would benefit from bottom side forced convection modules. These modules are an available option for the Ultralow II model and would cause a modest increase in gas consumption
| http://etasmt.com/cc?ID=te_news_bulletin,24967&url=_print
°C and reaches full liquidus at a range of 230-235°C — a mere 5°C below the maximum allowable temperature of 240°C. Maintaining such a small DT when processing any boards, and particularly laptop motherboards with Pentium BGA components, presents a significant reflow challenge
| http://etasmt.com/te_news_bulletin/2021-09-02/24967.chtml
°C and reaches full liquidus at a range of 230-235°C — a mere 5°C below the maximum allowable temperature of 240°C. Maintaining such a small DT when processing any boards, and particularly laptop motherboards with Pentium BGA components, presents a significant reflow challenge
| http://etasmt.com:9060/te_news_bulletin/2021-09-02/24967.chtml
°C and reaches full liquidus at a range of 230-235°C — a mere 5°C below the maximum allowable temperature of 240°C. Maintaining such a small DT when processing any boards, and particularly laptop motherboards with Pentium BGA components, presents a significant reflow challenge
