Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
SHADOWS INDICATE CRACKS As Published in EPP Europe May/June 2007 Microelectronics - Chip Scale Package CHIP-SCALE PACKAGES: INSPECTION METHODS FOR DIVERSE DESIGNS As Published in Electronics Engineer Nov 1997 CSP AND MICRO-BGA PROCESS AND DAMAGE ASSESSMENT WITH ACOUSTIC MICRO IMAGING As Presented at SMTA September 2000
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