SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
| https://www.eptac.com/faqs/ask-helena-leo/page/5
? Read More Dip Tinning Conductors with Low Temperature Insulation and Solder Pot Contamination QUESTION Question: We have an application that due to the type of stranded conductor being used, it may be necessary to semi-strip the insulation, flux and dip the conductor with the insulation slug still in place to
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. The paper also considers the use of solder TIMs in the context of alternative TIM applications and technologies, such as thermal greases, pads, and phase change materials, as well as liquid metals
