OEM Contract Manufacturer, Prototype production, battery testing, quick turn production, high/Low volume production. OEM products, complete box build, sub assembly, battery chargers, power supplies, microphones, cable and flex assembly.
Qualitek has developed a unique no clean flux system designed specifically for high temperature lead free alloys. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type. NC600 exhibits virtually no
Lead free water-soluble wire solder. Provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. WS700 exhibits virtually no spattering. WS700 conforms to J-STD-004, ORH1. Main Features Excellent wettability
Electronics Forum | Thu Sep 02 21:02:55 EDT 1999 | Paul Wareham
We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes?
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Vintage: 2008 Description: 3D Solder Paste Inspection Details: • 3D sensing system w/ built-in fiducial camera and lighting • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max PCB width: 20” x 20” • Max inspection
Vintage: 12/2011 Details • Automated Paste Dispenser • GridLoc System • Laser Paste Bead Height Sensor • Contrast Based 2D Inspection (paste on pad)- • Triple Track Conveyor System (66" Track Length). With Servo Driven Vision X, Y
Industry News | 2016-08-28 13:57:11.0
Europlacer’s flagship iineo II system offers the largest on-machine component inventory in the industry. It processes components from 01005 to 99mm in size, and can electrically test and verify RLC devices to calibrated international standards prior to assembly. Throughput is impressive from this highly flexible twin turret machine, which can handle the industry’s largest PCB, in-line, at 24" x 63".
Industry News | 2012-01-21 17:15:20.0
Seika Machinery will showcase its proven, advanced machinery in Booth #2401 at the upcoming IPC APEX Expo.
500/501/502/503/504/505/506/507/508 series nozzle for SMT JUKI machine KE2010——2040 PART No. PART NAME SIZE(mm) REMARKS E3608-729-0A0 #500 ASS'Y(2-HOLES) 0.5/1.0 E3600-729-0A0 #501 ASS'Y φ0.7/φ0.2 E3601-729-0A0 #502 ASS'Y φ0.7/φ0.4 E3602-729-0
500/501/502/503/504/505/506/507/508 series nozzle for SMT JUKI machine 1.Short leadtime; 2.Quality guaranteed; 3.all size and model available. 500/501/502/503/504/505/506/507/508 series nozzle for SMT JUKI machine KE2010_2040 PART No. PART NAME
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Feb 10 13:00:00 EST 2015 - Tue Feb 10 14:30:00 EST 2015 | ,
SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices
: For the non-collapsing BGA ball,... Author: Tom HSubject: 1913Posted: 21 Jun 2016 at 11:27amFor the non-collapsing BGA ball, here are the Ball Sizes / Pad Sizes
Paste Inspection Equipment The FX-500 ULTRA 3D SPI provides 3D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability