Industry News | 2003-05-02 08:58:57.0
Bob Ferguson has been appointed PWB General Manager, North America.
Industry News | 2023-08-22 06:02:56.0
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD
Industry News | 2013-03-04 16:08:13.0
IPC and the industry, Karen McConnell, Northrop Grumman, and Linda Woody, Lockheed Martin, earned IPC Presidents Awards at IPC APEX EXPO® in San Diego.
Industry News | 2011-07-06 08:42:50.0
ACD (Automated Circuit Design) announces that all of the company's material coordinators and machine operators are IPC-A-600 certified. The certification demonstrates ACD’s commitment to continuous quality improvement.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2016-02-17 16:31:00.0
Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Industry News | 2016-02-18 19:59:51.0
Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Industry News | 2012-09-20 14:20:40.0
More and more often electronics manufacturers have to deal with large, heavy or very thin boards which frequently require support pins for the placement process in order to prevent warping or vibrations. With its SIPLACE Smart Pin Support, ASM Assembly Systems provides a hardware-software combination that simplifies this previously cumbersome and complex support pin placement process for all boards.
Industry News | 2010-08-23 14:30:41.0
CyberOptics Corporation (NASDAQ: CYBE) will feature its award winning AOI and SPI In-Line inspection Systems at GlobalTRONICS 2010 scheduled to take place from September 13 - 15, 2010 at Sands Expo and Convention Centre, Hall A in Singapore.
Industry News | 2003-05-21 09:17:38.0
Enters into Licensing and Joint Development Alliance with ATMI
