Electronics Forum: qfp and lead and straightener (Page 1 of 2)

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F

Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert

I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i

optimun height between lead and pad?

Electronics Forum | Tue Dec 04 06:16:50 EST 2001 | Andy

For conventional QFP device, what is the optimun height between lead and pad? 50 microns or 100 microns? What is the factor affecting this height?

SMT, lead form and trim equipment

Electronics Forum | Mon Jul 20 10:23:29 EDT 1998 | Sherry

Hello friends.... Can someone please point me in the right direction... I will be needing the capability of forming/trimming QFP's on a very low volumn scale in house. So far I've only been able to find one manufacturer and that is Fancort Industri

Re: SMT, lead form and trim equipment

Electronics Forum | Mon Jul 20 13:28:14 EDT 1998 | Chris Fontaine

We regularly form QFP's and FP's (pitches to 20 mil) and have experience with both Knight and Fancort equipment, however most of our experience has been with Knight. Knight Tool has been consistently good, and I've had some sour experiences with Fan

BGA and PCB finishing

Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel

I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false

BGA and PCB finishing

Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel

I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false

PCB and component handling guidelines

Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis

Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture

PCB and component handling guidelines

Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis

Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture

J-STD-002 and -003 solderability testing...

Electronics Forum | Fri Jun 29 14:15:00 EDT 2001 | stefo

This is a question about complying with J-STD-001 solderability testing. Do any of you have your vendors certify that the components and PCB's that you buy from them comply with the solderabilty requirements spelled out in the -002 and -003, in lieu

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