Industry Directory: remove oxide from gold (2)

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Consultant / Service Provider / Manufacturer

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

New SMT Equipment: remove oxide from gold (51)

Gold Contact Replating Kit

Gold Contact Replating Kit

New Equipment | Rework & Repair Equipment

The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m

BEST Inc.

Gold Contact Replating Kit

Gold Contact Replating Kit

New Equipment | Rework & Repair Equipment

The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m

soldertools.net

Electronics Forum: remove oxide from gold (259)

Copper oxide

Electronics Forum | Thu Jul 31 15:41:23 EDT 2003 | davef

Q: Could any of you guys tell me what exactly is this greenish thing ? A: No, but is not copper oxide. Copper oxide is brown, the color of a penny [here in the US] or an untreated copper laminated trace on a board. Many copper salts are greenish in

How to remove Oxides from older components? Fine Pitch

Electronics Forum | Wed Jul 29 10:46:04 EDT 2009 | babe7362000

I was wondering if anyone knows the best way to clean oxides off of fine pitch components? Apparently the paste we use does not have strong enough flux to remove the oxides off of the leads of the components. I have validated the profile and that i

Used SMT Equipment: remove oxide from gold (1)

Electrovert EPK Gold Wave Solder

Electrovert EPK Gold Wave Solder

Used SMT Equipment | Soldering - Wave

Speedline Technologies Electrovert EPK Gold Wave Solder Machine - just removered from production in working conditon. Currently in production and available now. 11/2005 DOM, 208VAC 3 Phase Power, Reciprocating Spray Fluxer, L to R Board Flow, Heavy D

Assured Technical Service LLC

Industry News: remove oxide from gold (118)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Influences of the solder material for the wave soldering machine soldering quality

Industry News | 2018-10-18 08:04:17.0

Influences of the solder material for the wave soldering machine soldering quality

Flason Electronic Co.,limited

Technical Library: remove oxide from gold (1)

Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs

Technical Library | 2020-08-27 01:22:45.0

Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.

Teledyne DALSA

Videos: remove oxide from gold (11)

With the best heat transfer in the industry, the Centurion is able to run any profile at the lowest set point possible, which minimizes the thermal differences over the product and uses less energy.

With the best heat transfer in the industry, the Centurion is able to run any profile at the lowest set point possible, which minimizes the thermal differences over the product and uses less energy.

Videos

The Centurion™ is a forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments. With the best heat transfer in the industry, the Centurion is able to run any profile at the

ITW EAE

SV560A BGA Rework Station

SV560A BGA Rework Station

Videos

Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl

Precision PCB Services, Inc

Career Center - Resumes: remove oxide from gold (1)

Sr. Process & Quality Engineer

Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support

Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.

Express Newsletter: remove oxide from gold (890)

SMT Express, Issue No. 5 - from SMTnet.com

SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page HASL WHAT A HASSLE, or HASL'd AGAINby Earl Moon INTRODUCTION This article updates one I wrote for Printed

SMT Express, Volume 3, Issue No. 9 - from SMTnet.com

INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 72, (#ts#)) SMT Express, Volume 3, Issue No. 9 - from SMTnet.com Volume 3, Issue No. 9 Tuesday, September 18, 2001 Featured

Partner Websites: remove oxide from gold (87)

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Understanding the PCB Fabrication Process: From Design to Delivery

Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/

Understanding the PCB Fabrication Process: From Design to Delivery Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI

Imagineering, Inc.


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