LCR-Reader-MP is a multipurpose device for testing SMT and debugging PCBs. This model offers the highest basic accuracy of 0.1% and the most features of all Smart Tweezers and LCR-Reader devices, including test modes such as diode/LED testing, freque
PCB Washing machine Fixture cleaning equipment and Batch cleaning system Features: 1. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2.
Industry News | 2016-03-09 16:11:24.0
Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.
Industry News | 2016-08-17 21:07:09.0
Nordson ASYMTEK will present the paper Advanced Dispense Solutions for Hand-held Devices, at China Mobile Manufacture Forum (CMMF) on August 25, 2016. In addition, they will be exhibiting the latest in jet dispensing and conformal coating technologies in booth #1H20 at NEPCON South China, August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.
Technical Library | 1999-05-09 13:07:16.0
This paper will give the reader a general understanding of EOS and ESD phenomena. It specifically addresses hand soldering's role in EOS and ESD and how to protect against and test for potential problems. It discusses how Metcal Systems address EOS and ESD concerns and how they differ from conventional soldering systems.
Technical Library | 2007-05-31 19:05:55.0
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.
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and Figure 16 clearly shows the significant difference in the reliability of the U1 components, which were located in one corner of the test board, compared to the other BGA56 components. This indicated that the secondary failure mechanism was due to an