New Equipment | Fabrication Services
Our tool fabrication capabilities include: CNC milling CNC wire cutting Our injection molding capabilities include: 60 plastic injection molding machines Tonnage: 20 to 650 tons Overmolding Secondary operation such as: Silkscreening, Pad
New Equipment | Test Equipment
LCR-Reader-MP is a multipurpose device for testing SMT and debugging PCBs. This model offers the highest basic accuracy of 0.1% and the most features of all Smart Tweezers and LCR-Reader devices, including test modes such as diode/LED testing, freque
Industry News | 2016-03-09 16:11:24.0
Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.
Industry News | 2016-08-17 21:07:09.0
Nordson ASYMTEK will present the paper Advanced Dispense Solutions for Hand-held Devices, at China Mobile Manufacture Forum (CMMF) on August 25, 2016. In addition, they will be exhibiting the latest in jet dispensing and conformal coating technologies in booth #1H20 at NEPCON South China, August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
and Figure 16 clearly shows the significant difference in the reliability of the U1 components, which were located in one corner of the test board, compared to the other BGA56 components. This indicated that the secondary failure mechanism was due to an
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
voided test vehicles was subjected to secondary assembly using vacuum reflow processing to reduce the voiding. The x-ray images in Figure 7b (192CABGA) and Figure 8b (84CTBGA) show the resultant solder joint quality after vacuum reflow. In the expanded x
