New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product des
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Heller Industries Inc. | https://hellerindustries.com/searchqueries/
die attach lead frame die attach led die attach machine die attach reflow die attach shear test die attach silver epoxy die attach sintering die attach solder die attach substrate die attach system die
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
of the BEoL Region of a Flip Chip Package During Die Attach Process Zaeem Baig, Fahad Mirza, Hardik Parekh, Dereje Agonafer Abstract 27-2 Stencil and Solder Paste Inspection Evaluation for Miniaturized SMT Components Robert Farrell and Chrys Shea
