Specialists in end-of-life preservation packaging of electronics. Shelf-life consultants. Marketing, sales and distribution of Static Intercept and Corrosion Intercept Reative Polymers. Eliminating rust, tarnish and corrosion in metals-chemical free
We can help you eliminate rust, tarnish, corrosion, poor wetting and add years to your components or PC boards shelf-life. Dasal Technical Products, Inc. markets and distributes a state-of-the-art technology for the preservation and protection of met
We can help you elimante rust, tarnish, corrosion, poor wetting and years to your components and PC boards shelf-life. Dasal Technical Products, Inc. markets and distributes a state-of-the-art technology for the preservation and protection of metals.
Electronics Forum | Wed Jul 07 11:49:34 EDT 2004 | Svensen
Curiously... Shelf-life of the plating alternatives has been mentioned several times as a potential issue in these discussions. Tell me is there a market for a simple plastic packaging which could extend shelf life (and hence solderability) of these
Electronics Forum | Thu Apr 12 20:27:10 EDT 2001 | davef
Tantalum caps degrade over time. You should not be seeing "chipped-off & cracks" regardless of the age. This should not be a shelf-life issue, unless you are storing them in an aquarium. Tell us the story. Solderability is a shelf-life issue and
Industry News | 2009-11-24 22:07:52.0
Henkel’s in-depth materials development initiatives surrounding halogen-free innovation has yielded another process-enabling product. Multicore HF108 is a lead-free, halogen-free solder paste that combines all of the benefits of robust lead-free materials with the advantage of no deliberately added halogen and is now commercially available.
Industry News | 2013-03-18 17:06:13.0
AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Technical Library | 2009-12-03 12:51:58.0
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension.
Technical Library | 2024-06-19 15:23:54.0
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension. Component reliability was evaluated after extended storage to assure component solderability, MSL stability and die surface integrity. Packing materials were evaluated for customer use parameters as well as structural integrity and ESD properties. Results show that current packaging material (mold compound and leadframe) is sufficiently robust to protect the active integrated circuits for many decades and permit standard reflow solder assembly beyond 15 years. Standard packing materials (bags, desiccant, and humidity cards) are robust for a 32 month storage period that can be extended by repacking with fresh materials. Packing materials designed for long term storage are effective for more than five years.
