Industry Directory | Manufacturer
Manufacturer of Laser cut stencils, thick film screens, large format screens. Variety of stainless steel materials and mesh, ITAR registered. Member of SMTA, IMAPS and IPC.
Industry Directory | Manufacturer
professional manufacturer of pcb
Fully automatic Tape And Reel Package single-sided component cutting machine Model: SC-110 Voltage: AC 220V 60Hz/50Hz Size: L360*W210*H140MM Weight: 24kg Efficiency: 30000-60000PCS/H Product Description: 1. Suitable for cutting feet of single-sideb
Fully automatic Tape And Reel Package single-sided component cutting machine Model: SC-110 Voltage: AC 220V 60Hz/50Hz Size: L360*W210*H140MM Weight: 24kg Efficiency: 30000-60000PCS/H Product Description: 1. Suitable for cutting feet of single-sideb
Electronics Forum | Thu Jun 14 06:13:47 EDT 2012 | ccgooi
I am running a product with board size ~18"X16". I faced stencil aperture positional accuracy issue which slightly shifted at both end of stencil at positive and negative in X direction thus causing solder paste to pad mis-registration. Due to this s
Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark
What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended
Used SMT Equipment | Screen Printers
Momentum is designed to provide efficiency and speed. With its triple track conveyor rails and servo drive motors, for example, the Momentum Elite model orders the highest performance capacity in the series, making it the ideal printer for high volum
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, April 16, 2020, Subscribers: 35,920, Companies: 10,989, Users: 25,757 Stencil Printing 008004/0201 Aperture Components Credits: ITW EAE This paper will focus on the application requirements of solder printing small aperture designs
Stencil Printing of Small Apertures SMTnet Express October 25, 2012, Subscribers: 25748, Members: Companies: 9022, Users: 33865 Stencil Printing of Small Apertures First published in the 2012 IPC APEX EXPO technical conference proceedings
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_dispensers_camelot2800.html
Nd:YAG Marking Laser System Infared Laser, 1064Nm Unidex 11 Control Fixed Aperture Size: Aperture #2 is fixed until #1 is called Paddle Aperture #1 Size: .0635” Paddle Aperture #2 Size: 0=.08” Upcollimator: 6X Scan Field: 12” x 12” Focus Stick Length: 15.25” Paddle Aperture #1: 18 Watts
| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
• Skips in the printed solder due to blocked stencil aperture • Misaligned solder print • Improper stencil thickness • Inadequate stencil aperture size
