Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Thu Apr 11 16:37:16 EDT 2002 | pteerink
Profile would be the first place I look. Check your rise and fall rates for temp. Should be no more than 2 deg/sec for rise and 4-6 deg/sec for cooling. Phil
Electronics Forum | Tue Jun 17 07:17:09 EDT 2003 | James
The main problem I am having is getting the Rising slope 1-3 degrees. If I slow the conveyor down then I have too long of a reflow and if I speed it up then my ramp rate is too high. I was not sure if I need my first zones at a low temp or higher t
Used SMT Equipment | Soldering - Reflow
E Reflow with mesh belt and pin chain full convection oven In an ideal profile, preheat temperatures are maintained long enough to permit activation of fluxes, while exposure of the components to higher reflow temperatures is kept to a minimum. T
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Industry News | 2015-06-01 11:53:34.0
PCB Technology Trends 2014, a global biennial study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how PCB manufacturers are meeting today’s technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment.
Industry News | 2013-05-06 18:48:35.0
IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.
Parts & Supplies | SMT Equipment
PCB Support Pin Blocks Matrix Rubber Features: Just put the PCB board on the PCB Support Pin , you needn’t so any other things, it really save your time. Our PCB Support Pin is very soft, so all components on your PCB board will not be damaged.
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2009-07-22 18:33:41.0
This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV.
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
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. Generally, it is set at 80~160 ? and temperature should rise slowly (to get the best profile). For traditional profile, constant temperature zone lies between 140~160 ? . Please
