Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
supplier of clad & pure nickel powders and conductive fillers; additives used in the formulation of thermally & electrically conductive polymers, elastomers (emi gaskets and seals) & plastics with rf emi shielding properties.
New Equipment | Assembly Services
1). Bergquist Thermal Clad aluminium backed, 2). LTI-04503, MP-06503, ML-11006, HT-07006 3). Ceramic dielectric material, conductivity: 1.3W/m-k, 2.2W/m-k, 4). 1.6mm thick, single sided, 1oz 5). Black solder mask/no ident 6). CNC rout outline 7). Im
Pyralux® LF Copper-clad Laminate DuPont™ Pyralux® LF has been an industry standard in high reliability applications in the avionics industry for over 30 years and has a proven record of consistency and dependability and is ideal for aerospace and m
Electronics Forum | Mon Apr 29 16:56:13 EDT 2002 | gsmguru
Look at: http://www.bergquistcompany.com/therm.htm The material is made by Bergquist Inc. All sorts of good stuff on their website. Look under Thermal Clad. Dave G
Electronics Forum | Wed Apr 24 13:23:37 EDT 2002 | gsmguru
Our design group is looking at using a IMPCB material for a power amplifier design. They would like to to use this because of it's excellent thermal properties. This would be used to create a "SIP" module that would plug into a std FR4 pcb with the c
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Parts & Supplies | Circuit Board Assembly Products
1). 80*50mm/1up, Bergquist Thermal Clad aluminium backed 2). LTI-04503,MP-06503,ML-11006 3). Ceramic dielectric material, conductivity: 1.3W/m-k, 2.2W/m-k, 4). 1.6mm thick, single sided, 35μm (1 oz) 5). Black solder mask/no ident 6). CNC rout outli
Technical Library | 2017-08-24 16:53:20.0
With the rapid development of the information industry, increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In addition to the increasingly high performance requirements of CCL's, the present global attention to less toxic products is leading to an increase in the use of halogen-free flame retardants in electronics. (...) This paper introduces a new phosphonate oligomer which can be used as a reactive flame retardant in epoxy based resin systems. Suitable conditions for the complete reaction between the phosphonate oligomer and epoxy resin are described and the resulting halogen-free laminates with improved properties such as low Df, low coefficient of thermal expansion (CTE), high peel strength, and good toughness are presented.
FOR LARGE PCBS - The PDR IR-E6 Evolution rework system is specifically designed to be ultra-accurate and providing the ultimate performance when repairing today's PCB assemblies. The IR-E6 has a very large capacity, handling PCBs up to 26" (620mm) wi
SMTnet Express, August 24, 2017, Subscribers: 30,744, Companies: 10,648, Users: 23,699 Development of Halogen Free, Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer Dr. Lawino Kagumba - FRX Polymers Inc. ., Yang Zhong Qiang
SMTnet Express, February 10, 2022, Subscribers: 25,941, Companies: 11,514, Users: 27,054 MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications Copper clad laminates (CCLs) with low
| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. Glass fiber is usually used as a reinforcing material in composite materials, electrical insulation materials and thermal insulation materials, circuit boards and other fields of the national economy. ③ Polyimide
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID.pdf
electrical test, thermal stress, panelization, laminate selection, scoring and routing parameters, board thickness tolerance, nonfunctional lands, hole aspect ratios, via hole size and printed board
