Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.
Industry Directory | Manufacturer
Military Certified PCB Fabrication & Circuit Board Assembly Manufacturer Custom PCB fabrication in as little as 8 hours – All you have to do is ask! 16 Years Of PCB Manufacturing - Serving Electronic Since 2001
Manual press fit machine Press-fit technology Press-fit technology is that inserting flexible or rigid pins of connectors into plated through holes (PTHs) of printed circuit board (PCB) without soldering. It is reliable and easy to operate. The ba
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Press Fit Technology is the process of choice for many electrical engineering applications. Press Fit technology creates mechanically and electrically stable gaslight connections without the need for additional fastenings, soldering or thermal stres
Electronics Forum | Tue Jan 13 22:43:11 EST 2004 | davef
We have seen this in reflowed parts, where there is flux res collected in the dimple in the solder, where the lead 'presses' in the solder. Generally, we attack this as a thermal issue: * Thermal pads sucking the heat away from the leads. * Leads no
Electronics Forum | Tue Sep 23 18:48:57 EDT 2003 | ericsbrown
We have an application where we are applying a heatsink with a thermal tape that has pressure sensitive adhesive (psa) on either side. Does anyone know of an off-the-shelf heatsink press that we could use to apply a consistent, measured force for a
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2022-10-20 14:32:44.0
Full-auto SMT Production Line includes solder paste printer machine, SMT placement machine (upper surface electronic components), reflow soldering oven machine, plug-in, wave furnace, testing machine etc. The wide application of Full-auto SMT Production Line promotes the miniaturization and multi-function of electronic products, and provides conditions for mass production and low defect rate production.
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
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Parts & Supplies | Pick and Place/Feeders
> www.fujintai.com JUKI ESL13000000 VACUUM PAD 15 FUJINTAI TECHNOLOGY CO.,LTD JUKI ESL13000100 PHOTO MICRO SENSOR A www.fujintai.com JUKI ESL13001000 TUBE UNION (KL700) FUJINTAI TECHNOLOGY CO.,LTD JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) www.fujin
Technical Library | 2016-10-27 16:24:23.0
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair. This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
SMT is surface assembly technology, a new generation of electronic assembly technology developed from hybrid integrated circuit technology. SMT production line is also called surface assembly technology. Full-auto SMT Production Line is a new generat
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Jun 05 00:00:00 EDT 2018 - Thu Jun 07 00:00:00 EDT 2018 | Nuremberg, Germany
PCIM Europe 2018 - International Exhibition on Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
SMTnet Express, October 27, 2016, Subscribers: 26,530, Companies: 15,009, Users: 41,321 Press Fit Technology Roadmap and Control Parameters for a High Performance Process Jose Becerra, Dennis Willie and Murad Kurwa; Flex (Flextronics International
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/solder-paste-flux-and-tim
Solder Paste and Flux | Thermal Interface Materials (TIM) | Thermal Compound | Nordson EFD Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click Icon Close
ORION Industries | http://orionindustries.com/pdfs/osj/Orion%20OSJ%202013%20-%20Fall.pdf
Die Cutting Press Equipment *Small Business * ISO9001:2008 * CCR Registered * ITAR Registered #M18334 *Waterjet Cutting * Laser Cutting * High Speed Die Cutting
