Industry Directory | Distributor
Mayer Alloys stocks and supplies a complete line of tin and lead based alloys and lead free alloys.
Industry Directory | Manufacturer
manufactures solder preforms , hermetic covers , heat spreaders and custom welded assembllies
Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process development with solder alloy
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
Electronics Forum | Fri Oct 13 10:35:06 EDT 2006 | patrickbruneel
I just hope that lead-free alloys will only be used in tropical climates and above 13 C. Check here: http://materials.open.ac.uk/srg/srg_tp.htm Patrick
Electronics Forum | Fri Oct 13 11:55:23 EDT 2006 | patrickbruneel
I just hope that lead-free alloys will only be used in tropical climates and above 13 C. Check here: http://materials.open.ac.uk/srg/srg_tp.htm Patrick
Used SMT Equipment | Soldering - Selective
Make: Nordson Model: Select Novo 102 Vintage: 2020 Description: Selective Solder Details: Lead-Free Titanium Solder Pot & Pump Assembly Solder Pot Capacity: 30 lbs Software: SWAK-OS 4.0 (Includes Automated Fiducial Alignment, Board Warp Compensa
Used SMT Equipment | Soldering - Reflow
A8N Main electric part uses international brand components. Temperature control design achieves international advanced level with stable and even temperature. It is suitable for soldering CSP, BGA component. Energy-saving inner oven design and heat
Industry News | 2020-01-08 16:51:58.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
Industry News | 2016-11-22 17:42:42.0
During the 2016 Annual Meeting at SMTA International, the SMTA announced that Kate Reeve, a graduate student at Purdue University, has been selected as the recipient of the 2016 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys."
Parts & Supplies | Board Cleaners
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Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2019-06-19 11:06:46.0
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
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Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin
widely adopted Sn-3.0Ag-0.5Cu solder alloys for
| https://www.eptac.com/faqs/ask-helena-leo/ask/wet-sponge-cleaning-vs-dry-brass-sponge-cleaning
on the solder joint to get the good wetting needed to make an acceptable solder joint. It was also found, that the high tin alloy solders were very corrosive to the metals with which it came into contact
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/custom-interconnect-limited-installs-latest-nordson-select-novo-460pd-selective-soldering-system
, “As well as SAC305 RoHS alloy products, we have a number of military customers who still require tin-lead soldering. We can utilize the dual pot system of the Novo™
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