Industry Directory | Marketing Agency
B2B Strategic Marketing Communications, Specialties: Public Relations, Strategic Marketing Communications, Event Marketing, Media Planning & Placement, Social Media Marketing.
Industry Directory | Manufacturer
Manufacturer of automated production systems;PCB magazine loader,PCB separator,PCB cutting machine,PCB unloaders, PCB conveyors,PCB depaneling machines,PCB turn conveyors,PCB conformal coaters,PCB solder paste printer,PCB buffer
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Electronics Forum | Tue Aug 18 18:55:04 EDT 1998 | Sam Guilaume
Does anyone know the actual junction-to-case thermal resistance for TSOPII packages.
Electronics Forum | Thu Jun 13 02:20:43 EDT 2013 | mun4o
put the silk screen mask between pads.Add drain pads after TO220.
Used SMT Equipment | Pick and Place/Feeders
Name:YG88R Placement Speed:8400cph(0.43sec/CHIP Equivalent) Placement Range:0402(Metric base )to□55mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L1665XW1562 Weight:1650kg
Used SMT Equipment | SMT Equipment
Name:YG200 Model:KET-100 Placement Station:80 Placement Speed:45,000cph(0.08sec/CHIP Equivalent) Placement Range:0402(Metric base )to□14mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L1950XW1408 Weight:2080kg
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | General Purpose Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. /8" Mirror He
Parts & Supplies | Pick and Place/Feeders
PANASONIC FAE5600MA300 56mm FEEDER Feature : Name: Motorized Feeder. Specifications: Size: 56mm. Part Number: FAE5600MA300. Electric Source: AC 24V1A. Pneumatic Source: 0.4-to-0.43MPa. For BM Series Chip Mounter BM221 BM232 BM123. Brand :
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2020-01-13 09:48:06.0
Is it possible to coat electronic assemblies with a thin, uniform in thickness, pinhole-free, moisture impervious, truly hermetic (by the MIL-STD-883 definition) film of ceramic material that is far more affordable than placing the same electronic assemblies in the currently used glass-to-metal sealed, thick, heavy, metal-and-ceramic-based hermetic enclosures? Since the coating (called a “conformal coating”) would be both hermetic (moisture proof) and hundreds or thousands of times thinner than the currently used enclosures, it would be both less expensive, lighter, and still just as effective in excluding moisture (hermetic) as the current heavy, bulky, expensive electronic enclosures are.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Events Calendar | Thu Apr 16 00:00:00 EDT 2020 - Fri Apr 17 00:00:00 EDT 2020 | ,
Smart Fabrics Virtual Summit 2020
Events Calendar | Mon Jan 29 00:00:00 EST 2024 - Thu Feb 01 00:00:00 EST 2024 | Big Island, Hawaii USA
Pan Pacific Strategic Electronics Symposium
Career Center | bargain face-to-face, California USA | Engineering,Maintenance,Sales/Marketing,Technical Support
I.C.T Global Localization Recruitment | Join Our Team Today! We are actively seeking talented individuals from around the world to join our team. Take a look at the following positions available: 1. Senior SMT Engineer: 3 people 2. SMT Service E
Career Center | Raleigh, North Carolina USA | Engineering
Surface Mount Technology Engineer with minimum of 5 years experience in electronic assembly, engineering, process engineering in an electronics manufacturing environment. Some of this experience needs to be with Fuji equipment. Please submit resume
Career Center | hamtramck, Michigan USA | Production
• (from)2004 (to)2008 o Alterra Clare Bridge – Customer service, Dining Service Manager,Office Administrator #248-489-9362 . (from)2010 (to)2011 Yossi’s – Kitchen Manager, Pre Cook
Career Center | Newport Beach, California USA | Engineering,Management,Production
KEVIN RAGER P.O.BOX 7878, NEWPORT BEACH, 949 922 8997, KEVIN.RAGER@EDA-INC.US OBJECTIVE I am trying to find a consistent work flow that provides mentally challenging yet stimulating experiences in design and prototype development. EXPERIENCE 1997
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Send the Special Express To Others Email this Special Express to: Your friend Your co-worker A decision maker in your company A Colleague NOTE: You may re-use this e-mail form as many times
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_unable-to-connect-to-running-application_topic2498.xml
PCB Libraries Forum : unable to connect to running application PCB Libraries Forum : unable to connect to running application This is an XML content feed of
| https://www.eptac.com/blog/from-flip-to-flat-to-foldable-5g-smartphone-market-trends
From Flip to Flat, to Foldable 5G—Smartphone Market Trends Looking for solder training standards, manuals, kits, and more? Visit
