Technical Library: universal and instruments and 6241f and axial and series and 8 (Page 1 of 1)

Solar Panel Design Decision and General Information Sheet

Technical Library | 2014-04-10 18:04:04.0

This paper is meant to be a guide and a reference to new and old members alike who wish to know about, understand, and improve on the decisions made and processes implemented to build the current solar panels. The following paragraphs in the introduction will lay out background information on solar panels and cube satellites. This entire document was written with the idea that the reader will be able to follow the decisions made to construct the solar panels and then with this knowledge find areas of the project for improvement.

iSAT Group

Graphene electronic fibres with touch-sensing and light emitting functionalities for smart textiles

Technical Library | 2019-08-29 13:04:55.0

The true integration of electronics into textiles requires the fabrication of devices directly on the fibre itself using high-performance materials that allow seamless incorporation into fabrics. Woven electronics and opto-electronics, attained by intertwined fibres with complementary functions are the emerging and most ambitious technological and scientific frontier. Here we demonstrate graphene-enabled functional devices directly fabricated on textile fibres and attained by weaving graphene electronic fibres in a fabric. Capacitive touch-sensors and light-emitting devices were produced using a roll-to-roll-compatible patterning technique, opening new avenues for woven textile electronics. Finally, the demonstration of fabric-enabled pixels for displays and position sensitive functions is a gateway for novel electronic skin, wearable electronic and smart textile applications.

University of Exeter, College of Engineering, Mathematics and Physical Sciences

Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

Technical Library | 2007-06-27 15:43:06.0

Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.

Universal Instruments Corporation

The Relationship Between Energy-Resource Depletion, Climate Change, Health Resources and the Environmental Kuznets Curve: Evidence From the Panel of Selected Developed Countries

Technical Library | 2017-09-13 00:20:21.0

The objective of the study is to examine the relationship between energy-resource depletion, climate change, health resources and the Environmental Kuznets Curve(EKC) under the financial constraint environment in the panel of selected developed countries, over the period of 2000–2013.

Changan University

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