Technical Library | 2012-06-01 00:08:44.0
Recession survival tips on how and why not to cut training. ... About the methods for US Manufacturing Industry to adjust for the knowledge vacuum caused by retiring baby boomers with training, while dealing with tight training budgets during a recessio
Technical Library | 2015-11-05 15:09:27.0
There has been recent activity and interest in Laser-Cut Electroform blank foils as an alternative to normal Electroform stencils. The present study will investigate and compare the print performance in terms of % paste transfer as well the dispersion in paste transfer volume for a variety of Electroform and Laser-Cut stencils with and without post processing treatments. Side wall quality will also be investigated in detail. A Jabil solder paste qualification test board will be used as the PCB test vehicle.
Technical Library | 2018-09-10 08:44:08.0
Issue: Moisture and bubbles in your dispensing material with larger quantities Solution: Scheugenpflug’s 55-gal Barrel Agitator Station Barrel agitators for casting resins take their technology from the paint sector. They fall short of meeting the special demands of the auto, medical, aeronautics and electronics industries. They can’t guarantee a solid seal on the barrels – often containing expensive, moisture sensitive resins – allowing the humidity of the surrounding environment to damage the material. Also, conventional barrel agitators, as opposed to smaller units, cannot work in a vacuum to process materials directly.
Technical Library | 2021-11-22 20:39:44.0
Quality control is a key activity performed by manufacturing companies to verify product conformance to the requirements and specifications. Standardized quality control ensures that all the products are evaluated under the same criteria. The decreased cost of sensors and connectivity enabled an increasing digitalization of manufacturing and provided greater data availability. Such data availability has spurred the development of artificial intelligence models, which allow higher degrees of automation and reduced bias when inspecting the products. Furthermore, the increased speed of inspection reduces overall costs and time required for defect inspection. In this research, we compare five streaming machine learning algorithms applied to visual defect inspection with real world data provided by Philips Consumer Lifestyle BV. Furthermore, we compare them in a streaming active learning context, which reduces the data labeling effort in a real-world context. Our results show that active learning reduces the data labeling effort by almost 15% on average for the worst case, while keeping an acceptable classification performance. The use of machine learning models for automated visual inspection are expected to speed up the quality inspection up to 40%.
Technical Library | 2016-10-24 14:59:03.0
Temperature measurement is one of the most important physical parameters when determining quality, accuracy and reliability of processes not only in industrial use, but also in almost all human activities. Temperature sensors are produced with different technologies to fit specific application requirements. IST AG has concentrated one part of the development and manufacturing on high-end thin-film temperature sensors. This know-how is partially derived from the semiconductor industry and allows us to manufacture sensors with high accuracy, excellent long-term stability, high reliability and repeatability within a wide temperature range from -200 °C up to 1000 °C. Because of very small dimensions and low thermal mass, the thin-film temperature sensors exhibit a very short response time.
Technical Library | 2016-06-16 15:29:31.0
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.
Technical Library | 2012-12-27 14:35:29.0
Printed Electronics is generally defined as the patterning of electronic materials, in solution form, onto flexible substrates, omitting any use of the photolithography, etching, and plating steps commonly found within the Printed Circuit Board (PCB) industry. The origins of printed electronics go back to the 1960s, and close variants of several original applications and market segments remain active today. Through the 1980s and 1990s Printed Electronic applications based on Membrane Touch Switch and Electroluminescent lighting technologies became common, and the screen printed electronic materials used then have formed the building blocks for many of the current and emerging technologies and applications... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2020-08-13 00:59:03.0
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime. The nature of additive manufacturing allows designers to create custom components and devices for specialized applications and provides an excellent and inexpensive way of prototyping electronic designs. The combination of multiple printable materials enables the vertical integration of conductive, dielectric, and semi-conductive materials which are the fundamental components of passive and active circuit elements such as inductors, capacitors, diodes, and transistors. Also, the on-demand manner of printing can eliminate the use of subtractive fabrication processes, which are necessary for conventional microfabrication processes such as photolithography, and drastically reduce the cost and material waste of fabrication.
Technical Library | 2024-01-16 22:29:59.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components.
Technical Library | 2020-08-19 19:13:00.0
Commercially available health monitors rely on rigid electronic housing coupled with aggressive adhesives and conductive gels, causing discomfort and inducing skin damage. Also, research-level skin-wearable devices, while excelling in some aspects, fall short as concept-only presentations due to the fundamental challenges of active wireless communication and integration as a single device platform. Here, an all-in-one, wireless, stretchable hybrid electronics with key capabilities for real-time physiological monitoring, automatic detection of signal abnormality via deep-learning, and a long-range wireless connectivity (up to 15 m) is introduced. The strategic integration of thin-film electronic layers with hyperelastic elastomers allows the overall device to adhere and deform naturally with the human body while maintaining the functionalities of the on-board electronics. The stretchable electrodes with optimized structures for intimate skin contact are capable of generating clinical-grade electrocardiograms and accurate analysis of heart and respiratory rates while the motion sensor assesses physical activities. Implementation of convolutional neural networks for real-time physiological classifications demonstrates the feasibility of multifaceted analysis with a high clinical relevance. Finally, in vivo demonstrations with animals and human subjects in various scenarios reveal the versatility of the device as both a health monitor and a viable research tool.
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