Electronics Forum | Tue Apr 18 08:05:00 EDT 2000 | Wister
Hi, I got an interesting result after completing DOE that more open defects occurred higher the viscosity.The ppm would be 500 while the viscosity is 950 and it would be 1500 while the viscosity is 1050.The range of viscosity is 900 ~ 1100kcps. The p
Electronics Forum | Sat Jul 03 15:14:25 EDT 2010 | scsi
Hege, can you share more info on the formulation you ended up using for the micro dot dispensing? I'm trying to find the proper metal load and viscosity for the auger valve dispenser that we are developing and it looks like the regular low viscosity
Electronics Forum | Tue Oct 12 11:47:51 EDT 1999 | Jose RG
Hi, We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? 2- Is anybody using step stenc
Electronics Forum | Thu Jun 24 02:31:24 EDT 2004 | yukim
Currently we are having a lot of solder balls, after a few hours of continous production. This is how we work: load new solder paste at the beginning of the shift, less than 500grms. Then, the operator loads new solder paste periodically, every 3 to
Electronics Forum | Mon Sep 17 17:09:32 EDT 2001 | jschake
Flux: No-clean pastes tend to have a wider print process window in terms of print speed and pressure. More importantly, no-clean pastes are more tolerant to changes in temperature and humidity. They also exhibit longer stencil life than water-solub
Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Fri Jun 25 09:19:12 EDT 2004 | tjensen
60-70% RH will be a challenge if you are running a water wash solder paste (and could be the reason you are seeing the problems). If you are running a no-clean, humidity should not be an issue. As long as the profile looks OK, I don't think the con
Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F
| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
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