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Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2023-01-17 17:27:13.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)

Heller Industries Inc.

MIRTEC to Present Complete Line of Advanced 3D AOI and SPI Inspection Systems in Exclusive ONLINE CONFERENCE & EXPO

Industry News | 2020-06-30 15:07:32.0

MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.

MIRTEC Corp

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

Phoenix Micromex 180

Phoenix Micromex 180

Used SMT Equipment | X-Ray Inspection

Type: microme|x 180 SN:ANA01C0006-133908 Vintage: 2008 230 V 50/60 Hz 2000 VA 8.7 A 10 A

Baja Bid

DEK Horizon 01i

DEK Horizon 01i

Used SMT Equipment | Screen Printers

2006 DEK Horizon 01i Screen Printer 2D Solder Paste Inspection Green Camera S/W: 08 SPOS (930 B01) Accepts both [23" x 23"] & [29" x 29"] Stencils Manual Included Power: 230VAC; 1 Phase

Baja Bid

Seica Pilot

Seica Pilot

Used SMT Equipment | In-Circuit Testers

2005 Seica Pilot Flying Probe Tester O/S: Windows XP S/W: Viva 2.3.2.10 Top-Side Probes: 4 "Mobile" Bottom-Side Probes: 8 "Fixed" Power: 110VAC; 30A; 1 Phase or 230VAC; 14A; 1 Phase Air: Minimum = 73.5 PSI Machine Dimensions: 53" x 48

Baja Bid

Siemens SIPlace 80 S15

Siemens SIPlace 80 S15

Used SMT Equipment | Pick and Place/Feeders

1999 Siemens SIPLACE 80 S15 SMT Pick & Place Power: 230/400 VAC; 50/60 Hz Machine Dimensions: 64" x 100" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozzle Change Option Serial: 790-120

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Vitronics XPM3i 1030 Reflow Oven

Vitronics XPM3i 1030 Reflow Oven

Used SMT Equipment | Soldering - Reflow

Edge Rails Mesh Belt Notes: Fan speed controller damage CPU damage Serial: RI-X3N1046000 Features: Dimensions: 230" x 58" x 69"

Baja Bid

Seica Pilot Flying Probe Tester

Seica Pilot Flying Probe Tester

Videos

2005 Seica Pilot Flying Probe Tester O/S: Windows XP S/W: Viva 2.3.2.10 Top-Side Probes: 4 "Mobile" Bottom-Side Probes: 8 "Fixed" Power: 110VAC; 30A; 1 Phase or 230VAC; 14A; 1 Phase Air: Minimum = 73.5 PSI Machine Dimensions: 53" x 48

Baja Bid

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2024 Eptac IPC Certification Training Schedule

Benchtop Fluid Dispenser
Potting and Encapsulation Dispensing

Software for SMT placement & AOI - Free Download.
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications