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Wave soldering is the standard process that has been in use for many years to solder parts onto a circuit board. ... Selective soldering is an automated system that pumps molten solder up from a reservoir through a nozzle to coat the leads extending
Industry News | 2013-09-30 16:09:37.0
The inaugural IPC APEX India™ conference and exhibition was held 26–29 August at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-01-14 08:41:05.0
OK International will debut the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth #735 at the upcoming IPC APEX EXPO
Industry News | 2022-10-19 02:13:20.0
I.C.T Selective wave soldering is a special form of wave soldering invented to meet the development requirements of through-hole components soldering. It is mainly suitable for the soldering of through-hole components in high-end electronic products. For example: military electronic products, automotive electronics, switching power supply products and other industries which require higher soldering reliability.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
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Pcb assembly and Design Prototypes and Production Pick n Place Smd Reflow oven Medium-Low Transformer Manufacturing Electronic devices repair/service and hand soldering Wire cutting
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
Technical Library | 2023-06-12 18:52:18.0
This paper will review stencil design requirements for printing solder paste around and in through-hole pads / openings. There is much interest in this procedure since full implementation allows the placement of both through-hole components as well as SMD's and the subsequent reflow of both simultaneously. This in turn eliminates the need to wave solder or hand solder through-hole components.