Electronics Forum | Fri May 12 13:24:44 EDT 2000 | Stuart Adams
Is there a cost effective way to do assembly of boards with SMT components on boths sides as well as thru-hole parts ?? (Is there a solution other than hand-soldering the thru-hole parts after SMT reflow of both sides ???) Thanks, Stuart
Electronics Forum | Fri May 12 11:48:35 EDT 2000 | Mike Konrad
Advantages of using a stencil cleaner verses manually cleaning stencils: 1. Using a stencil cleaner ensures no direct contact between operator and solder paste (lead being the primary concern). 2. Most stencil cleaners remove 100% of the solder p
Electronics Forum | Tue May 09 09:49:15 EDT 2000 | paul richardson
Can someone give me DPMO numbers that are considered "world class" (if there is such a number) for... a)solder joints b)placement I appreciate any input that will get me closer to a number that will appease the bosses AND be realistic.
Electronics Forum | Mon May 08 16:26:29 EDT 2000 | Travis Slaughter
A common formula and perhaps more telling would be 1 defect for each solder joint and each part. For example a 1206 resistor could be 3 defects, a QFP128 could be 129 defects.
Electronics Forum | Wed May 03 21:07:36 EDT 2000 | Eric Chua
Hi Steve, I had face problem before. What I did, add addition process which is screen print that apply adhesive. During thru-hole assemble, the components hold strong by the solder. Try this.
Electronics Forum | Tue Apr 18 08:51:31 EDT 2000 | David Chapman
I have heard that a drwaback to VOC free flux in the wave solder machine is the machine will rust. Is this guy for real? What do you know about drawbacks vs. benefits of VOC free? Thanks
Electronics Forum | Fri Apr 14 15:46:17 EDT 2000 | Madan Mohan
I work on CSP Rework Process Development. Can anyone suggest a way by which the component top temperature during removal / replacement can be reduced for the same solder joint temperatures (for example providing metal shields over component top in t
Electronics Forum | Thu Apr 13 21:02:37 EDT 2000 | Mario Carluccio
Can anyone advise me what are the types of contaminants which can be present on a printed circuit board at the very beginning of a SMT line. Of these contaminants, are any of them detrimental to the SMT process (i.e. label application, or solder pas
Electronics Forum | Thu Apr 20 14:19:46 EDT 2000 | Joanne DeBlis
Hi Paul, Another method of achieving a planar surface is PPT. This may alleviate the problem your having. For additional information you can visit our web site at masktek.com. Joanne DeBlis
Electronics Forum | Tue Apr 11 14:59:05 EDT 2000 | Glenn Robertson
Jeremy - What's the process flow on these modules? Are they wave soldered? What is the board finish (ENG, HASL, etc.)? Glenn Robertson
