Electronics Forum | Wed Jan 10 17:18:11 EST 2007 | flipit
I am soldering a Germanium Window with a > metalized rim to a Ni-Au plated kovar lid. The > solder joint needs to be hermetic. I am using > 80In solder washer shape preform, but am > experiencing lots of voiding when x-rayed, > although the jo
Electronics Forum | Thu May 17 19:21:39 EDT 2007 | diesel_1t
We are currently using Oven Rider (ECD) to "verify" just the conduct of the peak temperature; we define which product is the higher runner for this line and then with the settings for this product (already profiled with thermal couples attached to th
Electronics Forum | Mon Aug 25 15:40:58 EDT 2008 | dyoungquist
I am seeing poor quality solder joints, mostly on 0402 components. The problem is that while the pad on the pcb is getting fully wetted, the solder is not flowing up the sides of the 0402 component, i.e. the 0402 lead is somewhat de-wetting. The re
Electronics Forum | Sun Mar 14 00:15:45 EST 2010 | dcell_1t
Well, not really... the index does not say much by itself, as you say, you can improve your cycle time by 5% but if you don't update the product rate in your calculation, then you're not providing accurate data so your performance is going to be high
Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist
We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X
Electronics Forum | Tue Sep 14 01:43:25 EDT 2021 | kumarb
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Electronics Forum | Mon Mar 15 01:09:45 EST 1999 | P.L. Sorenson - Technical Consultant
>>Date: Fri, 12 Mar 1999 12:09:57 +1000 >>>From: Paul Hardaker >>>Subject: [h-all] WARNING: Win32/Ska.A (Happy99) Worm >>>Sender: owner-h-all@ob1.uws.edu.au >>> >>>A relatively new, and quite serious "virus" (really a Worm or >>>Trojan Horse) called
Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.
Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
