Electronics Forum | Tue Dec 11 10:12:36 EST 2007 | George
Hi everybody, Is there any criteria as far as No-clean flux residues surrounding solder joints when using selective solder machines? I have a Novastar SPA 400 and use flux NC kester 959. If I decrease the amount of flux, then I experience problems w
Electronics Forum | Wed Oct 19 08:37:36 EDT 2011 | tombstonesmt
We also have a pillarhouse jade but opted for Kester 959T. The low solids content allows us to use a very small shot of flux thus resulting in low residue on the boards with great solder joints. Solderability is still good but had better results with
Electronics Forum | Fri May 07 12:02:28 EDT 2004 | Dreamsniper
From my understanding paste on BGA pads are applied only to help in holding the component as the PCB is conveyed during the manufacturing process then soldered. But during rework on BGA's do I have to apply Solder Paste or just Flux? What's the diffe
Electronics Forum | Mon Dec 15 15:34:17 EST 2008 | dyoungquist
Sorry it has taken me so long to respond. I got pulled off onto other projects and was not able to work on the solution to the problen until recently. The solution we have come up with is to change from no-clean flux based solder paste to water sol
Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas
You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica
Electronics Forum | Wed Mar 28 08:45:03 EDT 2007 | pjc
I have seen point-to-point soldering iron tip robots in action at a number of factories. The problem is repeatability at delivering good solder joints. Consider a small selective solder machine, the nozzle type: www.ace-protech.com www.air-vac-eng.c
Electronics Forum | Wed Jan 10 17:18:11 EST 2007 | flipit
I am soldering a Germanium Window with a > metalized rim to a Ni-Au plated kovar lid. The > solder joint needs to be hermetic. I am using > 80In solder washer shape preform, but am > experiencing lots of voiding when x-rayed, > although the jo
Electronics Forum | Wed Jul 15 05:36:34 EDT 1998 | Stoney Tsai
Bare board solderability plays a significant role of forming good solder joint. Currently, I can not find any information about bare board solderability testing procedure or methods. I think the procedure of testing should have some differentiations
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Sun Apr 03 10:07:40 EDT 2005 | davef
In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and columns, in space applications for the European Space Agency. One clear result was that amount of solder paste printed on the solder lands is very critic
