Electronics Forum | Mon Sep 13 11:23:41 EDT 1999 | Bing Feng
Hi, Recently encountered missing components problem at the SMT process. Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked the pick
Electronics Forum | Fri Sep 10 07:43:19 EDT 1999 | Christopher Cross
| I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?
Electronics Forum | Fri Sep 10 07:45:59 EDT 1999 | Christopher Cross
| | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?
Electronics Forum | Wed Sep 08 13:09:40 EDT 1999 | Joe Wayt
Hello: We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven. When the
Electronics Forum | Thu Aug 19 09:58:14 EDT 1999 | John Thorup
| | | we've received an inquiry if lead free solder for solder dips or surface mounting (cream solder) is available on a technical scale | Dr. Weber I'm not sure what you mean by "on a technical scale" but various no lead alloys are available in
Electronics Forum | Wed Aug 18 22:01:35 EDT 1999 | Stu Leech
We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale board
Electronics Forum | Wed Aug 18 22:02:24 EDT 1999 | Stu Leech
| We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale boa
Electronics Forum | Wed Aug 18 22:21:26 EDT 1999 | Dave F
| | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale b
Electronics Forum | Thu Aug 19 05:42:01 EDT 1999 | Brian
| We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale boa
Electronics Forum | Tue Aug 03 14:41:52 EDT 1999 | Paul O.
We're getting field failures in a high impedance portion of the circuit. Think the unpopulated pc card has contaminates because we were able to grow dendrites by applying a 9 volt battery across the suspected pad, placed a drop of de-ionized water o
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